Publication


Featured researches published by Etsuo Yamada.


Archive | 1997

Semiconductor device, manufacturing method thereof and aggregate type semiconductor device

Shinji Ohuchi; Yasushi Shiraishi; Hiroshi Kawano; Etsuo Yamada


Archive | 1996

Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip

Etsuo Yamada


Archive | 1995

Structure of resin molded type semiconductor device with embedded thermal dissipator

Etsuo Yamada; Yasushi Shiraishi; Hiroshi Kawano; Shinji Ohuchi; Hidekazu Nasu


Archive | 1999

Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support

Shinji Ohuchi; Hiroshi Kawano; Etsuo Yamada; Yasushi Shiraishi


Archive | 1995

Structure of resin molded type semiconductor

Etsuo Yamada; Yasushi Shiraishi; Hiroshi Kawano; Shinji Ohuchi; Hidekazu Nasu


Archive | 2005

Method of manufacturing a semiconductor device by using a matrix frame

Etsuo Yamada


Archive | 2003

Method of making a lead-on-chip device

Etsuo Yamada; Kenji Nagasaki; Yasushi Shiraishi; Kazuhiko Sera


Archive | 1997

Semiconductor device and assembling method thereof

Shinji Ohuchi; Etsuo Yamada; Yasushi Shiraishi


Archive | 1997

Semiconductor device which is crack resistant

Shinji Ohuchi; Etsuo Yamada; Yasushi Shiraishi


Archive | 1997

Semiconductor device and method of its fabrication

Hiroshi Kawano; Shinji Ohuchi; Yasushi Shiraishi; Etsuo Yamada

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