Etsuo Yamada

Semiconductor device, manufacturing method thereof and aggregate type semiconductor device

Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip

Structure of resin molded type semiconductor device with embedded thermal dissipator

Method of fabricating a semiconductor device having insulating tape interposed between chip and chip support

Structure of resin molded type semiconductor

Method of manufacturing a semiconductor device by using a matrix frame

Method of making a lead-on-chip device

Semiconductor device and assembling method thereof

Semiconductor device which is crack resistant

Semiconductor device and method of its fabrication