Eun-ju Bae

Aligned carbon nanotubes for nanoelectronics

We discuss the central issues to be addressed for realizing carbon nanotube (CNT) nanoelectronics. We focus on selective growth, electron energy bandgap engineering and device integration. We have introduced a nanotemplate to control the selective growth, length and diameter of CNTs. Vertically aligned CNTs are synthesized for developing a vertical CNT-field effect transistor (FET). The ohmic contact of the CNT/metal interface is formed by rapid thermal annealing. Diameter control, synthesis of Y-shaped CNTs and surface modification of CNTs open up the possibility for energy bandgap modulation. The concepts of an ultra-high density transistor based on the vertical-CNT array and a nonvolatile memory based on the top gate structure with an oxide–nitride–oxide charge trap are also presented. We suggest that the deposited memory film can be used for the quantum dot storage due to the localized electric field created by a nano scale CNT-electron channel.

Carbon-nanotube-based nonvolatile memory with oxide–nitride–oxide film and nanoscale channel

We have fabricated a single-wall carbon-nanotube (CNT)-based nonvolatile memory device using SiO2–Si3N4–SiO2 (ONO) layers as a storage node. The memory device is composed of a top gate structure with a channel width of a few nanometers and the ONO layer embedded between CNT and gate electrode. When the bias voltage between the CNT and gate electrode increases to 4 V, charges are tunneled out from CNT surfaces and captured to the traps in the ONO layers. Stored charges on the trap sites make the threshold voltage shift of 60 mV and is independent of charging time, suggesting that the ONO has traps with a quasiquantized energy state. The quantized state is related to the localized high electric field associated with CNT channel. The CNT-field-effect transistor with an ONO storage node could be used for an ultrahigh-density nonvolatile memory.We have fabricated a single-wall carbon-nanotube (CNT)-based nonvolatile memory device using SiO2–Si3N4–SiO2 (ONO) layers as a storage node. The memory device is composed of a top gate structure with a channel width of a few nanometers and the ONO layer embedded between CNT and gate electrode. When the bias voltage between the CNT and gate electrode increases to 4 V, charges are tunneled out from CNT surfaces and captured to the traps in the ONO layers. Stored charges on the trap sites make the threshold voltage shift of 60 mV and is independent of charging time, suggesting that the ONO has traps with a quasiquantized energy state. The quantized state is related to the localized high electric field associated with CNT channel. The CNT-field-effect transistor with an ONO storage node could be used for an ultrahigh-density nonvolatile memory.

Oxygen-induced p-type doping of a long individual single-walled carbon nanotube

The effect of oxygen adsorption on a nanotube-based field effect transistor have been controversial as to whether it induces p-type doping of the nanotube body or the work function increase in the metal electrode. Here we report a transport measurement showing that a long individual single-walled nanotube can be doped as p-type upon oxygen adsorption. We discuss that, despite the fact that the charge transfer between the nanotube and O2 adsorbator has not been agreed to date, the effect of oxygen adsorption should still be interpreted as inducing p-type doping in the nanotube body. The n-type doping by NH3 adsorption is also measured for the purpose of comparison. Based on these observations, we suggest that, while the Schottky barrier management could be more effective for the transistor with a short nanotube, the doping effect could be more influential in devices with longer nanotubes.

Adsorption-induced conversion of the carbon nanotube field effect transistor from ambipolar to unipolar behavior

We investigate ambipolar to unipolar transition by the effect of ambient air on the carbon nanotube field-effect transistor. A unipolar transport property of the double-walled nanotube field-effect transistor and its conversion from ambipolar behavior are observed. We suggest that adsorptions of oxygen molecules, whose lowest-unoccupied-molecular-orbital state is around the midgap of the carbon nanotube, could suppress the electron channel formation and, consequently, result in the unipolar transport behavior.

Ambient air effects on electrical characteristics of GaP nanowire transistors

Gallium phosphide (GaP) nanowire transistors were fabricated in back-gated structure, and their electrical characteristics were measured systematically in both air and vacuum. The transistors turn on typically between −5 and −7V in ambient air. However, a large threshold voltage (Vth) shift, ∼10V, toward negative gate bias was observed in vacuum. After the transistors were exposed to air for 48h, Vth returned to the similar value in ambient air, implying a reversible process. The rate of Vth shift slows down when they were exposed to N2 in comparison with that of air. The shift of Vth is believed to be related to the charge transfer from the surface of GaP nanowire to the physically adsorbed OH or oxygen. In addition, the observed Vth shift from the GaP nanowire transistors can be explained by the conventional n-channel depletion mode metal-oxide-semiconductor field-effect transistor.

Feasibility studies on pyroelectric emission for lithography application

Abstract Electron beam patterns of ferroelectric switching emission, dielectric emission, and field emission were studied by patterning images on electron beam resist. It was observed that the pyroelectric emission is most acceptable for an 1:1 electron projection lithography application. Effects of the initial kinetic energy of electrons and distance between the emitter and the collector on pattern resolution were discussed. An 1:1 electron projection lithography was demonstrated by patterned emitter.

Electrical Property of Vertically Grown Carbon Nanotube and Its Application to the Nanofunctional Devices

Abstract : A highly ordered porous alumina array which hole size is decreased down to 20nm was fabricated by a two step anodization method. Carbon Nanotube was grown vertically with thermal CVD at 6OO-7OO degrees C. By using rapid thermal annealing method, low-ohmic contact was formed between multi wall nanotubes and metal electrode and its resistance shows tens to hundreds ohms. The alumina layer which is existed between nanotube and electrode acts as a barrier for conductance. The resistance of carbon nanotube shows the temperature(T exp-1) dependence at 4.21K < T < 19.9K and semiconducting behavior at this temperature region.