Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Ferdinand Quella is active.

Publication


Featured researches published by Ferdinand Quella.


International Journal of Life Cycle Assessment | 2003

Integrating environmental aspects into product design and development the new ISO TR 14062

Ferdinand Quella; Wulf-Peter Schmidt

ConclusionIt is recommended to transfer the general standard to the company-specific management systems, tools and cultures. Practical experience is necessary to identify its limits in each case. The future development of this Technical Report to a management system standard may not be difficult — and even necessary as shown in the paper. The problem occurs in the variety of opportunities to be implemented. Again, the integration shall be tailored to the existing management systems, in particular ISO 9001/14001. In addition, the design


Monatshefte Fur Chemie | 1979

Untersuchung des Zerfalls verschiedener Azoinitiatoren in Lösung

Dietrich Braun; Wolfgang Brendlein; Ferdinand Quella

The decomposition of various symmetric and unsymmetric azo-initiators (1,1′-dichloro-1,1′-diphenyl-1,1′-azoethane, 2,2′-dichloro-2,2′-azopropane, 1,1′-dichloro-1,1′-azocyclohexane, 2,2′-diacetoxy-2,2′-azopropane, 1,1′-diacetoxy-1,1′-diphenyl-1,1′-azoethane, 1,1′-diacetoxy-1,1′-azocyclohexane, 2,2′-dipropionoxy-2,2′-azopropane, 2,2′-dicapronoxy-2,2′-azopropane, 4,4′-dimethyl-1,4′-azobutyrolactone, azoisobutyronitrile, 2-t-butylazo-2′-cyanobutan, 2-t-bytylazo-1′-cyanocyclohexan) in solution was studied in dependence of temperature. Volumetry and differential-scanning-calorimetry (DSC) were used to determine decomposition rates; first order kinetics was found in all cases.


Archive | 2010

Sustainability as a Competitive Business Advantage

Wolfgang Wimmer; Kun Mo Lee; Ferdinand Quella; John Polak

“Sustainability”, “Sustainable Development”, and “Corporate Social Responsibility” are all terms that are increasingly being used in daily communication. Also, companies are finding that the use of environmental claims in their marketing efforts can pay dividends. Product performance related to “lower energy consumption”, “better recycling rates”, etc., are often declared. But, in considering Sustainability or Sustainable Development from a more holistic perspective, the broader picture needs examination.


IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 1991

Correlations of dynamic mechanical measurements to the stress formation by molding compounds

Ferdinand Quella; Manfred Bogner; Winfried Holzapfel; Raimund Schwarz

Semiempirical estimation of stress by the integrated value of the products from shear modulus and the coefficients of thermal expansion are not suitable to differentiate between commercially used low-stress molding compounds. A modified evaluation procedure is presented. Prior to multiplying the curves of shear modulus and thermal expansion, one must shift to the same glass transition temperature (T/sub g/) because of all of the values are frequency dependent. The conclusion is that the T/sub g/ of improved compounds should be situated outside of all the occurring temperatures at given frequencies. Another influence on stress that must be considered is the adhesion strength between the molding compound and substrate (silicon, leadframe, etc.). The authors applied nondestructive testing methods for composites to the combination of the silicon and the compound. The data obtained by dynamic mechanical experiments are contradictory to published data. Post-cure increases the adhesion of standard compounds to the substrate, whereas adhesion of siloxane-modified low-stress compounds is weakened. >


Archive | 2012

New Trends in Ecodesign

Wolfgang Bloch; Ferdinand Quella

Over the last several years the focus on eocdesign moved away from the design of components or simple products only towards the design of systems. Especially the European product-related legislation, e.g. WEEE, RoHS, ErP and REACh, became a major driving force for integrating new design aspects like energy efficiency, materials and resource efficiency and design principles for recycling into the product design process. Standardization of design principles helps companies to meet internationally introduced regulatory requirements. In addition ecodesign principles are extended to the design of manufacturing sites and include the complete supply chain.


Archive | 2010

Outlook: Sustainability – What Does the Future Hold?

Wolfgang Wimmer; Kun Mo Lee; Ferdinand Quella; John Polak

This book has attempted to help the reader prepare for the future – to come up with better products, to adapt the way we do business, and to incorporate a way of thinking that will facilitate tomorrow’s success.


Archive | 2010

Action Plan Development

Wolfgang Wimmer; Kun Mo Lee; Ferdinand Quella; John Polak

Following the situation analysis from Chapter 2 and the identified strategies in Chapter 3 it is now time to discuss concrete action to implement Ecodesign in the company. We know where the weak points are, and what the improvement strategies look like. It is now time to take action again on corporate, market, product, production and management level. It is time to come up with an action plan.


8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium | 1990

Adhesion between moulding compound and substrate

M. Bogner; Winfried Holzapfel; M. Maier; Ferdinand Quella; R. Schwarz

A theory taken from composite materials is applied to determine the adhesion between molding compound and chip by means of nondestructive dynamic-mechanical experiments. A test rod with an incorporated metal strip (Cu, Si, etc.) can be used to determine adhesion strength as a characteristic quality feature. The advantage compared with destructive test methods is that the same rod can be used for temperature-dependent measurements and can be reused after different storage cycles. The results indicate a worse adhesion between the low-stress molding compounds and copper or silicon in comparison with standard materials.<<ETX>>


Archive | 1987

Irradiation cross-linkable thermostable polymer system, for microelectronic applications

Klaus Budde; Friedrich Koch; Ferdinand Quella


Archive | 1987

Method and coating material for applying electrically conductive printed patterns to insulating substrates

Juergen Frankel; Antoon Mattelin; Pol Pecceu; Ferdinand Quella; Hans-Fr. Dr. Schmidt; Luc Boone; Sybille von Tomkewitsch; Marc De Vogelaere

Collaboration


Dive into the Ferdinand Quella's collaboration.

Researchain Logo
Decentralizing Knowledge