Frank Daeche

Electronic device with cavity and a method for producing the same

Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Elektronisches Bauteil mit Hohlraum und ein Verfahren zur Herstellung desselben

Multiple layer switch support used in flip-chip technology comprises a semiconductor chip and/or a discrete component, a rewiring layer, an insulating layer with through-structures, and outer contact surfaces

INTEGRATED CIRCUIT PACKAGE AND PACKAGING METHODS

Chip package and method for manufacturing the same

Low profile packaging solution for RF-MEMS suitable for mass production

Power Semiconductor Module with Embedded Chip Package

INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE