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Frank Lambrecht

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Publication

Featured researches published by Frank Lambrecht.

Archive | 2012

Stub minimization for multi-die wirebond assemblies with parallel windows

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2015

Multiple die face-down stacking for two or more die

Belgacem Haba; Wael Zohni; Richard DeWitt Crisp; Ilyas Mohammed; Frank Lambrecht

Archive | 2012

Stub minimization for multi-die wirebond assemblies with orthogonal windows

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2012

STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2014

Stub minimization using duplicate sets of signal terminals

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2012

Stub minimization for assemblies without wirebonds to package substrate

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2012

Stub minimization for wirebond assemblies without windows

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2012

Stub minimization using duplicate sets of terminals for wirebond assemblies without windows

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2014

Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

Archive | 2016

STUB MINIMIZATION USING DOUBLE SET OF SIGNAL TERMINAL IN ASSEMBLY WITH NO WIRE BOND FOR PACKAGE BOARD

Richard DeWitt Crisp; Wael Zohni; Belgacem Haba; Frank Lambrecht

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Collaboration

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Belgacem Haba

Samsung

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Ilyas Mohammed

Tessera Technologies

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