Frank Yu

Mold compound fracture mode study for high reliability package

This paper presents TI development of high reliability molding compound material for power enhancement packages with PPF LDF. The mold gate remains due to good molding compound high adhesion and low flexural strength/Modulus are observed in several packages during mass production run. Correlations of adhesion and modulus change with Respect to its fracture strength under different conditions are studied. As a result, the gate remains solved by achieving the sweet spot based on material properties on optimized molding parameters. The gate remains on LDF side rail which will be stuck at T&F process. A modification to dies and LDF design can jump across the hurdle, but high investment needed. With this study, the gate remains can be conquered after an effective DOE with the proper understanding of Material (Mold compound) properties and Mold Machines capability.

Low cost fillers die attach materials development for powerpad and non powerpad packages with PPF LDF

This paper presents TI development of low cost fillers die attach materials for powerpad and non powerpad packages with PPF LDF. While silver fillers drive conductive die attach applications in semiconductor history, eagerness for a promising alternative filler die attach has been arising to get rid of silver filler die attach price impacted by silver price on the market. Besides the short term cost benefit, how to maintain the long term cost advantage across the rivals is another priority for development. Silver plated copper (SPC) filler die attach materials have attracted a lot of attentions due to the relative higher thermal conductivity and lower cost of metal copper comparing with other metals. Although there has been available silver plated copper die attach materials in semiconductor industry, however the low thermal conductivity constrains the application in powerpad packages especially for the weak adhesion performance of PPF Au/Pd/Ni LDF. In addition to silver plated copper fillers, many opportunities are being engaged and evaluated for promising long term cost advantages die attach materials for electronic packaging. Among of them, copper filler is the most interesting target for the super low cost die attach materials. Quality and reliability of low cost metals die attach materials have been validating via extensive evaluation plan on powerpad and non powerpad packages in recent and confirmed as noteworthy solutions for further development.