Lance Cole Wright
Texas Instruments
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Publication
Featured researches published by Lance Cole Wright.
international workshop on thermal investigations of ics and systems | 2007
Julia Czernohorsky; Bartosz Maj; Matthias Viering; Lance Cole Wright; Gerry Balanon
Subject of this paper is the thermal investigation of epoxy (EDA) and solder (SDA) die attaches by a comparison of an ASIC with multiple heat sources in different package assemblies. Static and transient thermal measurements and simulations were performed to investigate the thermal behavior of two samples in a state of the art QFP power package differing only in the die attach material (EDA and SDA).
Archive | 2002
Lance Cole Wright; Albert Dulay Escusa
Archive | 2012
Frank Yu; Lance Cole Wright; Chien Te Feng; Sandra J. Horton
Archive | 2004
Lance Cole Wright
Archive | 2014
Matthew D. Romig; Lance Cole Wright; Leslie E. Stark; Frank Stepniak; Screenivasan K. Koduri
Archive | 2014
Andy Quang Tran; Lance Cole Wright
Archive | 2014
Matthew D. Romig; Lance Cole Wright; Leslie E. Stark; Frank Stepniak; Sreenivasan K. Koduri
Archive | 2012
Matthew D. Romig; Lance Cole Wright; Leslie E. Stark; Frank Stepniak; Sreenivasan K. Koduri
Archive | 2005
Lance Cole Wright; Albert Dulay Escusa
Archive | 2003
Lance Cole Wright; Albert Dulay Escusa
