Fredrik Engelmark

Reactive Sputter Deposition of Highly Oriented AlN Films at Room Temperature

Textured as well as epitaxial thin AlN films are of great interest for a wide range of electro-acoustic and optoelectronic applications. Reduction of the deposition temperature is of vital importance in a number of applications due to thermal budget limitations. In this work we systematically studied the influence of the process parameters on the film properties and identified the factors leading to improved film quality as well as reduced deposition temperature with pulsed direct current sputtering in an Ar/N 2 atmosphere. We demonstrated that fully textured (0002) films can be grown under a wide range of conditions. At the same time the full width at half-maximum (FWHM) of the rocking curve of the (0002) XRD peak was found to vary systematically with process conditions-depostion rate, process pressure, gas composition, and substrate temperature. The best films showed a FWHM of 1.2°. We found that by far the most important factor is the arrival energy of the sputtered Al atoms, which is primarily controlled by the process pressure. We report for the first time that fully textured AlN films with a FWHM of under 2° can be grown at room temperature. Other important factors are the ion and electron bombardment of the films and substrate temperature as well as gas composition, although their influence is not as dramatic. Generally, the film quality increases with temperature. Bias and electron bombardment within a certain range also lead to better films.

Synthesis of highly oriented piezoelectric AlN films by reactive sputter deposition

Nucleation and growth of polycrystalline AlN films on thermal and chemical vapor deposited oxide have been studied during rf reactive sputter deposition. The influence of the growth conditions, namely deposition pressure, rf power, Ar/N2 ratio, and substrate temperature, on film properties has been systematically studied. The properties of interest are crystallinity, degree of orientation, crystallite size, surface roughness, stress, piezoelectric coupling, acoustic velocity, and others. The films have been analyzed with Rutherford backscattering spectroscopy, electron spectroscopy for chemical analysis, x-ray diffraction (XRD), ellipsometry, scanning electron microscopy, atomic force microscopy, stress measurements, etc. It is found that these properties are sensitive functions of all deposition parameters and that there exist optimal deposition conditions under which films of high quality are obtained. The films at optimal conditions were analyzed with the following results: full width half maximum (FWH...

Structural and electroacoustic studies of AlN thin films during low temperature radio frequency sputter deposition

AIN is a material used in a wide variety of applications such as electroacoustic devices, blue diodes, IR windows, thermal conductors, metal-insulator-semiconductor structures, integrated circuit packaging, etc. In this work thin piezoelectric AIN polycrystalline films have been grown on Si and SiO2 using rf magnetron sputter deposition in an Ar/N-2 gas mixture. The structural properties of the film have been optimized by varying the deposition parameters, such as process pressure, gas mixture, substrate temperature, discharge power, etc. [K. Tominaga et al., Jpn. J. Appl. Phys., Part 1 35, 4972 (1996); H. Okana et al., ibid. 31, 3446 (1992); K. Kazuya, T. Hanabusa, and K. Tominaga, Thin Solid Films 281-282, 340 (1996)]. It was found that the best film texture was obtained for a particular set of parameters, namely process pressure of 4 mTorr, substrate temperature 350 degreesC, discharge power 350 W, and a gas mixture of 25% Ar and 75% N-2. The films as examined by x-ray diffraction exhibited a columnar structure with a strong (001) texture, and a fall width at half maximum (FWHM) rocking curve of 1.6 degrees. Atomic force microscopy measurements indicated a surface roughness with a rms value of 8 Angstrom. Classical nonapodized transversal surface acoustic wave filters operating at a frequency of 534 MHz were fabricated to characterize the electroacoustic properties of the films. The measurements indicated a coupling coefficient of 0.37% and a phase velocity of 4900 m/s. Further, thin epitaxial films were grown on (001)alpha -Al2O3 (sapphire) under the same deposition conditions except the substrate temperature. The films exhibited a (001)AlN//(001)alpha -Al2O3 plane orientation with a (002) rocking curve FWHM value of about 0.4 degrees, showing a relatively good alignment of the c axis. The in-plane orientation was [110]AlN//[120]alpha -Al2O3 corresponding to a rotation of the AIN film of 30 degrees with respect to the (001)alpha -Al2O3 surface. Cross-sectional transmission electron microscopy studies indicated a population of both thread and edge dislocations with decreasing concentrations with film thickness

Electrical characterization of AlN MIS and MIM structures

Aluminum nitride (AlN) thin films have been deposited on p-Si[100] and Mo-Si[100] substrates. The sputter deposited Mo was polycrystalline, predominantly showing a [110] orientation. Thin AlN films were grown under different process conditions in a physical vapor deposition (PVD) system to attain highly textured polycrystalline films as well as close to amorphous films. MIS and MIM structures were fabricated and electrical properties such as the dielectric constant, leakage current, and high-frequency behavior were investigated. It is found that the dielectric constant is 10 and does not change with the crystallinity of the films. High-frequency measurements up to 10 GHz show no frequency dispersion of the capacitance. The leakage current stays relatively constant between films and is believed to be Poole-Frenkel controlled. Capacitance-voltage (C-V) measurements for MIS structures revealed the presence of charges in the interface layer between the substrate and the dielectric film. The temperature dependence of the capacitance has also been studied.

Synthesis of c-axis-oriented AlN thin films on high-conducting layers: Al, Mo, Ti, TiN, and Ni

Thin piezoelectric polycrystalline films such as AlN, ZnO, etc., are of great interest for the fabrication of thin film bulk/surface acoustic resonators (TFBARs or TFSARs). It is well-known that the degree of c-axis orientation of the thin films correlates directly with the electromechanical coupling. However, the degree of c-axis orientation of the piezoelectric film is, in turn, influenced by other parameters such as the structure of the substrate material, the matter of whether the c-axis is up or down (polarity), and the growth parameters used. The correlation of these three aspects with the electromechanical coupling of the AlN-thin films, is studied here. Thin AlN films, prepared in a magnetron sputtering system, have been deposited onto thin Al, Mo, Ni, Ti, and TiN films. Such thin high-conducting layers are used to form the bottom electrode of TFBAR devices as well as to define a short-circuiting plane in TFSAR devices. In both cases, they serve as a substrate for the growth of the piezoelectric film. It has been found that the degree of orientation and the surface roughness of the bottom metal layer significantly affects the texture of the AlN films, and hence its electroacoustic properties. For this reason, the surface morphology and texture of the metal layers and their influence on the growth of AlN on them has been systematically studied. Finally, FBARs with both Al and Ti electrodes have been fabricated and evaluated electroacoustically.

SAW COM-parameter extraction in AlN/diamond layered structures

Highly c-axis oriented aluminum nitride (AlN) thin piezoelectric films have been grown on polycrystalline diamond substrates by pulsed direct current (DC) magnetron reactive sputter-deposition. The films were deposited at a substrate temperature below 50/spl deg/C (room temperature) and had a typical full width half maximum (FWHM) value of the rocking curve of the AlN-002-peak of 2.1 degrees. A variety of one-port surface acoustic wave (SAW) resonators have been designed and fabricated on top of the AlN films. The measurements indicate that various SAW modes are excited. The SAW phase velocities of up to 11.800 m/s have been measured. These results are in agreement with calculated dispersion curves of the AlN/diamond structure. Finally, the coupling of modes parameters have been extracted from S/sub 11/ measurements using curve fitting for the first SAW mode, which indicate an effective coupling K/sup 2/ of 0.91% and a Q factor of about 600 at a frequency of 1050 MHz.

Simulation and dielectric characterization of reactive dc magnetron cosputtered (Ta2O5)1−x(TiO2)x thin films

New capacitor material with high dielectric constant is needed for future integrated capacitor structures. Tantalum pentoxide (Ta2O5) is considered as one of the most promising candidates. In this article, thin films of (Ta2O5)1−x(TiO2)x were grown utilizing reactive dc magnetron cosputtering of tantalum and titanium in an argon/oxygen atmosphere. By varying the input power at the targets, the composition of the thin film is easily controlled. The composition of the films was analyzed with elastic recoil detection analysis revealing the titanium oxide content (x ranging from 0 to 0.40). The presented results indicate that reactive sputter deposited tantalum pentoxide, with or without the addition of titanium, exhibits the properties required to meet the demands for future dielectric materials in integrated capacitors. The dielectric constant for metal-insulator-semiconductor structures is about 20 and the leakage current density is below 10 nA/cm2 at 0.5 MV/cm, if the annealing temperature does not exceed...

Selective etching of Al/AlN structures for metallization of surface acoustic wave devices

Metallization is a critical step in the fabrication of high frequency AlN thin film based surface acoustic wave devices. Both state-of-the-art lithography as well as high selectivity and anisotropy during etching of Al with respect to AlN are required for low loss and high performance devices. In this work, the etch rates of reactively sputtered AlN, sputtered Al, thermal SiO2, and Shipley 1813 photoresist as well as the selectivity among Al/AlN, Al/SiO2, and resist/Al have been systematically studied during inductively coupled plasma (ICP) etching. Emphasis is focused on obtaining high Al etch rates, while at the same time keeping the etch rate of AlN and that of the resist sufficiently low. High anisotropy is obtained by passivating the sidewalls by the addition of oxygen. The recipe developed is based on a modified Al etch using a mixture of BCl3, Cl2, O2. The parameters varied were gas composition, and substrate bias. Generally it is found that the Al etch rate exhibits a maximum with the O2 flow, whi...

Influence of deposition parameters on the stress of magnetron sputter-deposited AlN thin films on Si(100) substrates

The Influence of the Deposition Parameters on the Stress of Magnetron Sputter Deposited AlN Thin Films on Si (100) Substrates

Li conduction in sputtered amorphous Ta2O5

Electron and Li ion conducting properties of room temperature sputtered amorphous tantalum oxide (a-Ta2O5) films were studied in order to evaluate the feasibility of using a-Ta2O5 in electrochromic ...