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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Fumio Furusawa is active.

Publication


Featured researches published by Fumio Furusawa.


Archive | 2004

Epoxy resin molding material for sealing use and semiconductor device

Ryoichi Ikezawa; Naoki Nara; Hideyuki Chaki; Yoshihiro Mizukami; Yoshinori Endou; Takaki Kashihara; Fumio Furusawa; Masaki Yoshii; Shinsuke Hagiwara; Mitsuo Katayose


Archive | 2000

Epoxy resin composition for sealing semiconductor and semiconductor device sealed with the same

Seiichi Akagi; Masanobu Fujii; Fumio Furusawa; Shinsuke Hagiwara; Takayoshi Kashiwabara; Hirooki Koujima; 文夫 古沢; 博起 幸島; 隆貴 柏原; 伸介 萩原; 昌信 藤井; 清一 赤城


Archive | 1998

PHENOLIC RESIN, RESIN COMPOSITION, MOLDING MATERIAL FOR ENCAPSULATION, AND ELECTRONIC COMPONENT DEVICE

Haruaki Sue; Shinsuke Hagiwara; Fumio Furusawa; Seiichi Akagi; Kazuyoshi Tendo


Archive | 2001

Phenyl, naphthly or fluorene cyclopentyl epoxy resins

Haruaki Sue; Shinsuke Hagiwara; Fumio Furusawa; Seiichi Akagi; Akihiro Kobayashi; Hideki Yokoyama


Archive | 1999

Semiconductor-sealing resin composition and resin-sealed type semiconductor device

Teruki Aizawa; Seiichi Akagi; Fumio Furusawa; Yasuyuki Hirai; Hideo Nagase; Ken Nanaumi; 憲 七海; 文夫 古沢; 康之 平井; 輝樹 相沢; 清一 赤城; 英雄 長瀬


Archive | 1985

EPOXY MOLDING MATERIAL FOR SEALING ELECTRONIC COMPONENT

Fumio Furusawa; Shinsuke Hagiwara; Etsuji Kubo


Archive | 1990

Semiconductor sealing epoxy resin molding material

Fumio Furusawa; Shinsuke Hagiwara; Shigeki Ichimura; Keiichi Kinashi


Archive | 1990

Synthesis of silicone-modified phenolic resin

Fumio Furusawa; Ryoichi Ikezawa; Keiichi Kinashi; Ken Nanaumi


Archive | 1998

Resine phenolique, composition a base de cette resine, materiau de moulage pour encapsulation et dispositif a composants electroniques

Haruaki Sue; Shinsuke Hagiwara; Fumio Furusawa; Seiichi Akagi; Kazuyoshi Tendo


Archive | 1997

Cyclopentylene compounds and intermediates therefor, epoxy resin composition, molding material, and resin-sealed electronic device

Haruaki Sue; Shinsuke Hagiwara; Fumio Furusawa; Seiichi Akagi; Akihiro Kobayashi; Hideki Yokoyama

Collaboration


Dive into the Fumio Furusawa's collaboration.

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