Ken Nanaumi
Hitachi
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Publication
Featured researches published by Ken Nanaumi.
Polymers for Advanced Technologies | 1996
Atsushi Takahashi; Takeshi Horiuchi; Masahiro Nomoto; Ken Nanaumi; Kazunori Yamamoto
Printed wiring boards (PWBs) with high wiring density such as thin multilayer PWBs and flexible PWBs requiring bonding sheets with superior thermal and adhesive properties, and must have a flat board surface. To meet these requirements, a polymer alloy adhesive film made up of epoxy resins and aromatic polyester has been developed. The crosslinking reaction between the components was utilized to improve thermal properties. The polymer alloy adhesive film demonstrates good heat resistance and adhesiveness. It features a low processing pressure of 2 MPa at 170°C and gives the board surface greater flatness, which is better for the fine wiring of PWBs.
Archive | 2009
Hiroshi Matsutani; Takumi Ueno; Alexandre Nicolas; Yukihiko Yamashita; Ken Nanaumi; Akitoshi Tanimoto
Archive | 2009
Hiroshi Matsutani; Takumi Ueno; Alexandre Nicolas; Ken Nanaumi
Archive | 2001
Kazumasa Takeuchi; Tetsuya Saito; Ken Nanaumi
Archive | 1998
Kazumasa Takeuchi; Tetsuya Saito; Ken Nanaumi
Archive | 1997
Teruki Aizawa; Yasuyuki Hirai; Minoru Kakiya; Shinichi Kamoshita; Hideo Nagase; Ken Nanaumi; Shunichi Numata; Kenichi Ohori; Yoshinori Sato; 憲 七海; 義則 佐藤; 稔 垣谷; 健一 大堀; 康之 平井; 俊一 沼田; 輝樹 相沢; 英雄 長瀬; 真一 鴨志田
Archive | 1979
Ken Nanaumi; Fusaji Shoji; Hisashi Kohkame; Susumu Era
Archive | 1992
Haruaki Sue; Ken Nanaumi; Takuji Itou; Ken Madarame; Shinsuke Hagiwara
Archive | 1997
Atsushi Takahashi; Shinji Ogi; Koji Morita; Kazunori Yamamoto; Ken Nanaumi; Kiyoshi Hirosawa; Akinari Kida; Takao Hirayama; Toshihiko Ito; Hiroaki Hirakura
Archive | 1978
Susumu Konii; Yukio Yoshimura; Ken Nanaumi; Kohei Yasuzawa; Takeshi Yoshida; Toyotaro Shinko
