Galyna Melnychuk

Effect of HCl addition on gas-phase and surface reactions during homoepitaxial growth of SiC at low temperatures

A complex influence of HCl addition on gas-phase and surface reactions during the low-temperature halo-carbon homoepitaxial growth of 4H-SiC was investigated. The addition of HCl was employed to reduce the undesirable effects of homogeneous gas-phase nucleation leading to formation of silicon clusters in the gas phase. It was established that dissociation of silicon clusters by HCl is efficient even at untraditionally low homoepitaxial growth temperature below 1300 °C. The information about the spatial distribution of this dissociation process along the gas flow direction was obtained. It was established that the influence of HCl is more complicated than the simple model suggesting that the enhanced dissociation of silicon clusters in the gas phase leads to an additional supply of silicon species for the epitaxial growth. While the growth rate does significantly increase at least for some HCl flow rates, complex changes in the effective silicon-to-carbon ratio in the growth zone of the reactor indicate th...

Low-Temperature Halo-Carbon Homoepitaxial Growth of 4H-SiC: Morphology, Doping, and Role of HCl Additive

Low-temperature epitaxial growth of 4H-SiC with CH3Cl carbon precursor was further developed. In-situ doping with nitrogen and aluminum was investigated. The nitrogen concentration in epitaxial layers grown on the C face was almost two orders of magnitude higher than that in the Si-face epilayers grown in the same growth run at 13000C. The opposite trend was observed for intentional aluminum doping, with more than an order of magnitude higher aluminum concentration incorporated in Si-face epilayers. High values of nitrogen and aluminum doping well in excess of 1020 cm-3 without any obvious epilayer morphology degradation can be achieved on C-face and Siface respectively. Addition of HCl during halo-carbon growth at 13000C resulted in drastic improvement of the surface morphology. Also, a significant increase of the growth rate took place confirming that the improvement in the epilayer morphology during HCl-assisted growth is predominantly related to silicon cluster etching by additional Cl-containing vapor species.

Lower-Temperature Epitaxial Growth of 4H-SiC Using CH3Cl Carbon Gas Precursor

The advantages of the CH3Cl carbon precursor were investigated in order to achieve good-quality homoepitaxial layers of the 4H-SiC polytype at temperatures lower than what was considered practical (or even possible) with C3H8-based growth. It was observed that the process window for good epilayer morphology becomes narrower when the growth temperature is decreased. Successful growth experiments have been conducted in this work down to a temperature of 1290-13000C, with the growth rate in excess of 2 +m/hr and a mirror-like defect-free epilayer surface morphology. Growth on a 2” substrate produced promising growth rate homogeneity. The dependence of the growth rate on SiH4 flow followed a clear exponential dependence. This trend is tentatively attributed to Si vapor condensation. Photoluminescence results suggest that the crystalline quality of the epilayers grown at 13000C is comparable to that of 17000C growth.

Dislocations and Triangular Defect in Low-Temperature Halo-Carbon Epitaxial Growth and Selective Epitaxial Growth

Dislocations were investigated in the halo-carbon low-temperature epitaxial growth and low-temperature selective epitaxial growth (LTSEG) conducted at 13000C. The origin of triangular defects was investigated in low-temperature epilayers grown at higher growth rates with HCl addition. Due to the conversion of substrates’ basal plane dislocations (BPD) into threading dislocations, the concentration of BPDs was about an order of magnitude lower than the concentration of threading dislocations at moderate growth rates. An additional order of magnitude conversion of BPDs into threading dislocations was observed at higher grow rates achieved with HCl addition. In LTSEG epilayers, dislocation concentration away from the mesa walls was comparable to the blanket (i.e., regular non-selective) growth. High concentrations of BPDs were found only at mesa edges located on the “upstream” side with respect to the step-flow direction. No substrate defects could be traced to the triangular defects. Instead, the disturbances causing the triangular defect generation are introduced during the epitaxial process.

Nitrogen Doping in Low-Temperature Halo-Carbon Homoepitaxial Growth of SiC

In this work, nitrogen doping was investigated during the low-temperature halo-carbon epitaxial growth of 4H-SiC on Si- and C-faces. The dependencies of nitrogen incorporation on nitrogen flow rate, Si/C ratio, growth rate, and temperature were investigated. It was established that the efficiency of nitrogen incorporation for the C-face growth at 1300 °C is higher than that for the Si-face for a wide range of the growth conditions. Seeming deviation of the Si/C ratio dependence from the “site-competition” trend confirmed the critical role of the silicon vapor condensation during the low-temperature epitaxy. Opposite trends for the nitrogen doping dependence on the growth rate were observed on the Si- and C-faces. Finally, a complex temperature dependence of the nitrogen doping in the temperature range from 1300 to 1450 0C was observed.

Aluminum Doping by Low-Temperature Homoepitaxial Growth for Ni Ohmic Contacts to p-Type 4H-SiC

Low-temperature halo-carbon homoepitaxial growth is suitable for selective epitaxial growth of 4H-SiC using SiO2 mask. A possibility of achieving high values of doping in combination with the selective growth makes it an alternative to ion implantation for selective doping in SiC. In this work, TMA doping in situ during a blanket low-temperature epitaxial growth was utilized to produce heavily Al doped SiC layers for Ohmic contact formation to p-type SiC. Nearly featureless epilayer morphology with Al atomic concentration exceeding 3x1020 cm-3 was obtained after growth at 13000C with the growth rate of 1.5 µm/hr. Ni TLM contacts with a thin adhesion layer of Ti were formed. The as-deposited metal contacts were almost completely Ohmic even before annealing. The specific contact resistance of 2x10-2 Ohm-cm2 and 6x10-5 Ohms-cm2 was achieved without and with contact annealing respectively. The resistivity of the epitaxial layers better than 0.01 Ohm cm was measured for Al atomic concentration of 2.7x1020 cm-3.

Use of SiCl4 as Silicon Precursor for Low-Temperature Halo-Carbon Epitaxial Growth of 4H-SiC

Chlorinated silicon precursor SiCl4 was investigated as an alternative to SiH4 with HCl addition as a source of additional chlorine in order to suppress the homogeneous nucleation during the low-temperature epitaxial growth at 1300°C. The homogeneous nucleation in the gas phase was further reduced compared to SiH4+HCl growth. The process window for obtaining good epilayer morphology during the CH3Cl/SiCl4 growth was found to correspond to Si supply-limited mode. At lower values of C/Si ratio formation of Si-rich polycrystalline islands/droplets took place. At high C/Si ratio, formation of polycrystalline SiC was the source of morphology degradation. The process window became increasingly narrower at higher Rg, which limited the possibility of significantly increasing Rg at such low growth temperatures. Generation of triangular defects became significant at Rg above 5-6 μm/hr, even when a nearly-optimal value of C/Si ratio was used. Similar experiments were conducted using C3H8, a more traditional precursor, instead of the halo-carbon precursor CH3Cl. While a similar growth rate could be achieved for the same SiCl4 flow rate, much lower values of the C/Si ratio were required. The morphology with C3H8 was worse within the process window. The C/Si process window for the C3H8/SiCl4 growth was much narrower compared to the CH3Cl/SiCl4 growth, and the window essentially disappeared at Rg > 3 4 μm/hr.

Low-Temperature Homoepitaxial Growth with SiCl4 Precursor Compared to HCl Assisted SiH4-based Growth

Chlorinated silicon precursor SiCl4 was investigated as a source of additional chlorine instead of or in combination with HCl during the low temperature (13000C) halo-carbon epitaxial growth. No Si cluster cloud was visible inside the hot-wall susceptor indicating negligible homogeneous gas-phase nucleation. The growth rate was significantly enhanced compared to the SiH4-case, but was relatively close to the SiH4+HCl case. Similar to the SiH4+HCl growth, the increase of the growth rate caused by suppressed cluster formation was less significant than expected. The depletion of the growth species by vigorous polycrystalline deposition upstream of the hot zone, which was earlier reported for the SiH4+HCl growth, was also significant in the SiCl4-based growth. Closer to the growth zone, carbon species also get incorporated in the polycrystalline deposits.

Local-Loading Effect in Low-Temperature Selective Epitaxial Growth of 4H-SiC by Halo-Carbon Method

In this work, the local-loading effect and its influence on the growth rate enhancement and the growth rate non-homogeneity is investigated during the halo-carbon low-temperature selective epitaxial growth (LTSEG) using an SiO2 mask. The average growth rate during the LTSEG can be more than three-times higher than in blanket epitaxy at the same growth conditions. Both the size of the LTSEG seed windows and the surrounding area covered with the mask determine the growth rate non-homogeneity. A model for predicting the growth rate distribution is suggested.

Factors Influencing the Growth Rate, Doping, and Surface Morphology of the Low-Temperature Halo-Carbon Homoepitaxial Growth of 4H SiC with HCl Additive

In this work, a possibility to further suppress silicon vapor condensation and formation of Si clusters in order to improve the growth rate and morphology during the low-temperature halo-carbon epitaxial growth of 4H-SiC was investigated. While a pronounced dissociating of Si clusters was clearly demonstrated, the enhancement of the growth rate and morphology was less significant then expected. In addition, the homogeneity of the growth rate and doping along the gas flow direction indicated that a significant and non-equal depletion of Si and C growth species takes place at sufficiently high HCl supply. HCl flow-dependent formation of polycrystalline Si and SiC deposits in the upstream portion of the hot zone was shown to be the source of this depletion.