Gari Arutinov

Capillary Self-Alignment of Mesoscopic Foil Components for Sensor-Systems-in-Foil

This paper reports on the effective use of capillary self-alignment for low-cost and time-efficient assembly of heterogeneous foil components into a smart electronic identification label. Particularly, we demonstrate the accurate (better than 50 μm) alignment of cm-sized functional foil dies. We investigated the role played by the assembly liquid, by the size and the weight of assembling dies and by their initial offsets in the self-alignment performance. It was shown that there is a definite range of initial offsets allowing dies to align with high accuracy and within approximately the same time window, irrespective of their initial offset.

In-Plane Mode Dynamics of Capillary Self-Alignment

We present an experimental study of the complete in-plane dynamics of capillary self-alignment. The two translational (shift) and single rotational (twist) in-plane modes of square millimetric transparent dies bridged to shape-matching receptor sites through a liquid meniscus were selectively excited by preset initial offsets. The entire self-alignment dynamics was simultaneously monitored over the three in-plane degrees of freedom by high-speed optical tracking of the alignment trajectories. The dynamics of the twist mode is shown to qualitatively follow the sequence of dynamic regimes also observed for the shift modes, consisting of initial transient wetting, acceleration toward, and underdamped harmonic oscillations around the equilibrium position. Systematic analysis of alignment trajectories for individually as well as simultaneously excited modes shows that, in the absence of twist offset, the dynamics of the degenerate shift modes are mutually independent. In the presence of twist offset, the three modes conversely evidence coupled dynamics, which is attributed to a synchronization mechanism affected by the wetting of the bounding surfaces. The experimental results, justified by energetic, wetting, and dynamic arguments, provide substantial benchmarks for understanding the full dynamics of the process.

Dynamics of capillary self-alignment for mesoscopic foil devices

We report experimental evidence for three sequential, distinct dynamic regimes in the capillary self-alignment of centimeter-sized foil dies released at large uniaxial offsets from equilibrium. We show that the initial transient wetting regime, along with inertia and wetting properties of the dies, significantly affect the alignment dynamics including the subsequent constant acceleration and damped oscillatory regimes. An analytical force model is proposed that accounts for die wetting and matches quasi-static numerical simulations. Discrepancies with experimental data point to the need for a comprehensive dynamical model to capture the full system dynamics.

Foil-to-Foil System Integration Through Capillary Self-Alignment Directed by Laser Patterning

This paper introduces a new integration technology for cost-effective high-precision mechanical and electrical integration of mesoscopic functional foil components onto foil substrates. The foil-to-foil assembly process is based on topological surface structuring via laser patterning that enables accurate capillarity-driven self-alignment of foil dies. The concurrent establishment of high-yield electrical interconnections is obtained through conductive adhesives. The foil surface energy controls the acceptance window of initial offsets for optimal self-alignment performance. The proposed topological patterning and system design enable alignment accuracies for centimeter-sized foil dies as high as 15 μm, barely influenced by the evaporation of the assembly liquid and curing of the conductive paste. Full foil-to-foil system integration is demonstrated through the electrically functional assembly of an array of Au-sputtered capacitive humidity sensors onto a patterned base foil circuitry.

Capillary Gripping and Self-Alignment: A Route Toward Autonomous Heterogeneous Assembly

We present a pick-and-place approach driven by capillarity for highly precise and cost-effective assembly of mesoscopic components onto structured substrates. Based on competing liquid bridges, the technology seamlessly combines programmable capillary grasping, handling, and passive releasing with capillary self-alignment of components onto prepatterned assembly sites. The performance of the capillary gripper is illustrated by comparing the measured lifting capillary forces with those predicted by a hydrostatic model of the liquid meniscus. Two component release strategies, based on either axial or shear capillary forces, are discussed and experimentally validated. The release-and-assembly process developed for a continuously moving assembly substrate provides a roll-to-roll-compatible technology for high-resolution and high-throughput component assembly.

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.

Hybrid integration on low-cost flex foils using photonic flash soldiering

Soldering of packaged electronic components using industry standard Sn-Ag-Cu (SAC) lead-free solders on low-cost foils, which are often the substrate of choice for flexible electronics, is challenging. This is mainly originating from the fact that the reflow temperatures of these solder alloys are normally higher than the maximum processing temperature of the low-cost flex foils. To enable component integration on the low-cost foils a novel method for soldering has been introduced by Holst Centre as an alternative to oven reflow, termed “photonic soldering”. In this method high intensity photonic flashes are used to deliver the thermal energy required for soldering. By taking advantage of the selectivity of light absorption, the required energy for soldering is delivered to the components and circuit tracks while excessive heating of the foils is avoided. This paper presents successful photonic flash soldering of packaged LED components on low-cost polyethylene terephthalate (PET) foils using conventional SAC solders as a demonstration of the capabilities of this novel soldering technology.

Shift Dynamics of Capillary Self-Alignment

This paper describes the dynamics of capillary self-alignment of components with initial shift offsets from matching receptor sites. The analysis of the full uniaxial self-alignment dynamics of foil-based mesoscopic dies from pre-alignment to final settling evidenced three distinct, sequential regimes impacting the process performance. The dependence of accuracy, alignment time and repeatability of capillary self-alignment on control parameters such as size, weight, surface energy and initial offset of assembling dies was investigated. Finally, we studied the influence of the dynamic coupling between the degenerate oscillation modes of the system on the alignment performance by means of pre-defined biaxial offsets.

Capillary self-alignment dynamics for R2R manufacturing of mesoscopic system-in-foil devices

This paper reports a study on the dynamics of foil-based functional component self-alignment onto patterned test substrates and its demonstration when integrating a flexible sensor onto a printed circuitry. We investigate the dependence of alignment time and final precision of stacking of mm- and cm-sized foil dies on a number of system parameters, such as amount of assembly medium dispensed on target positions, size and weight of assembling dies and their initial misalignment. Using water as a medium for direct self-alignment, mm- and cm-sized square-shaped pre-marked foil dies were aligned with accuracy down to 30 μm and smaller, which reflects a high precision relatively to their lateral dimensions on patterned marked carriers. High-speed camera stage and image recognition tools were used for analyzing rapid capillary-driven self-alignment processes of marked foil dies. It is shown that there is a definite range of initial misalignment values allowing dies to align with high accuracy and yield within the same time window, whereas both under smaller and larger initial offsets, i.e. with dies correspondingly too close or too far from their target positions, yield and alignment precision is significantly lower. The high-alignment accuracy of mm- to cm-sized functional foils was demonstrated by means of the integration of an interdigitated electrodes (IDE) capacitive sensor to a flexible polymeric substrate. Additionally, high-yield electrical interconnection was performed using anisotropic conductive adhesives (ACA). The latter opens the perspective of efficiently assembling interesting new systems such as separately manufactured sensors, paper batteries and RFIDs components through the direct capillary-driven self-alignment approach and ACA electrical interconnection.