Garry Cunningham

Planar PbS quantum dot/C60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

Of interest for both photovoltaic and photodetector applications is the ability of colloidal quantum dot (CQD) devices to provide response further into the infrared than is typical for other solution-processable materials. Here, we present a simple heterojunction diode structure that utilizes the extended infrared absorption of PbS CQDs. We show that device performance benefits from a discontinuous exciton blocking layer which improves charge separation without limiting charge extraction. By enhancing charge carrier mobility in the CQD layer, we demonstrate a planar heterostructure device with a power conversion efficiency of 5.2% under 1 sun illumination.

The effects of deposition conditions and annealing temperature on the performance of gallium tin zinc oxide thin film transistors

In this work the performance of bottom gate thin film transistors (TFTs) with transparent amorphous gallium tin zinc oxide (GSZO) active layers fabricated by radio frequency sputter deposition using a single GSZO target on SiO2/Si wafers will be presented. Trap density and its energetic distribution, and oxygen chemisorption were found to play a critical role in determining the operational characteristics of the device, all of which can be controlled by the oxygen incorporation and substrate temperature during deposition, along with the post-deposition annealing. In addition device instability, with respect to the electrical stress and optical illumination, can be suppressed by suitably tailoring these parameters. TFTs exhibiting a drain current (ID) of 10-6 A and on/off current ratio (Ion/off ) of 106 was achieved. A stable TFT has been achieved under electrical stress for 2% oxygen flow exhibiting ΔVT as low as ~0.5 V for 3hr stress under a gate bias of 1.2 and 12 V, with good optical stability.

Investigation of the effects of deposition parameters on indium-free transparent amorphous oxide semiconductor thin-film transistors fabricated at low temperatures for flexible electronic applications

Low temperature gallium tin zinc oxide (GSZO) based thin film transistors fabricated on silicon has been investigated as a potential indium free transparent amorphous oxide semiconductor thin film transistor (TAOS TFT) with potential device applications on plastic substrates. A comprehensive and detailed study on the performance of GSZO TFTs has been carried out by studying the effects of processing parameters such as deposition temperature and annealing temperature/duration, as well as the channel thickness with all temperatures held below 150 °C. Variety of characterization techniques, namely Rutherford backscattering (RBS), x-ray photoelectron spectroscopy (XPS) and x-ray reflectivity (XRR) in addition to I-V and C-V measurements were employed to determine the effects of the above parameters on the composition and quality of the channel. Optimized TFT characteristics of ID=3×10-7 A, ION/OFF =2×106, VON ~ -2 V, SS ~ 1 V/dec and μFE = 0.14 cm2/V· s with a ΔVON of 3.3 V under 3 hours electrical stress were produced.

Room temperature SWIR sensing from colloidal quantum dot photodiode arrays

While InGaAs-based focal plane arrays (FPAs) provide excellent detectivity and low noise for SWIR imaging applications, wider scale adoption of systems capable of working in this spectral range is limited by high costs, limited spectral response, and costly integration with Si ROIC devices. RTI has demonstrated a novel photodiode technology based on IR-absorbing solution-processed PbS colloidal quantum dots (CQD) that can overcome these limitations of InGaAs FPAs. The most significant advantage of the CQD technology is ease of fabrication. The devices can be fabricated directly onto the ROIC substrate at low temperatures compatible with CMOS, and arrays can be fabricated at wafer scale. Further, device performance is not expected to degrade significantly with reduced pixel size. We present results for upward-looking detectors fabricated on Si substrates with sensitivity from the UV to ~1.7 µm. We further show devices fabricated with larger size CQDs that exhibit spectral sensitivity that extends from UV to 2 µm.

High-performance SWIR sensing from colloidal quantum dot photodiode arrays

RTI has demonstrated a novel photodiode technology based on IR-absorbing solution-processed PbS colloidal quantum dots (CQD) that can overcome the high cost, limited spectral response, and challenges in the reduction in pixel size associated with InGaAs focal plane arrays. The most significant advantage of the CQD technology is ease of fabrication. The devices can be fabricated directly onto the ROIC substrate at low temperatures compatible with CMOS, and arrays can be fabricated at wafer scale. Further, device performance is not expected to degrade significantly with reduced pixel size. We present results for upward-looking detectors fabricated on Si substrates with sensitivity from the UV to ~1.7 μm, compare these results to InGaAs detectors, and present measurements of the CQD detectors temperature dependent dark current.

Solution-processed colloidal quantum dot photodiodes for low-cost SWIR imaging

While InGaAs-based focal plane arrays (FPAs) provide excellent detectivity and low noise for SWIR imaging applications, wider scale adoption of systems capable of working in this spectral range is limited by high costs, limited spectral response, and costly integration with Si ROIC devices. RTI has demonstrated a novel photodiode technology based on IR-absorbing solution-processed PbS colloidal quantum dots (CQD) that can overcome these limitations of InGaAs FPAs. We have fabricated devices with quantum efficiencies exceeding 50%, and detectivities that are competitive with that of InGaAs. Dark currents of ~2 nA/cm2 were measured at temperatures compatible with solid state coolers. Additionally, by processing these devices entirely at room temperature we find them to be compatible with monolithic integration onto readout ICs, thereby removing any limitation on device size. We will show early efforts towards demonstrating a direct integration of this sensor technology onto a Si ROIC IC and describe a path towards fabricating sensors sensitive from the visible to 2200 nm at a cost comparable to that of CMOS based devices. This combination of high performance, dramatic cost reduction, and multispectral sensitivity is ideally suited to expand the use of SWIR imaging in current applications, as well as to address applications which require a multispectral sensitivity not met by existing technologies.

Wearable sensors for skin heating and electric field strength in harsh environments

Two novel sensor technologies have been developed for the measurement of skin surface temperature and RF field strength in an RF environment. Such a sensor system would be particularly useful in the test and evaluation of directed energy systems. The sensors operate without being affected by the presence of RF fields and with minimal perturbation of the fields, therefore having a minimal effect on a test. The sensors are designed to be wearable and interface with a portable, battery powered electronics pack by optical fibers. The temperature sensor is based on the variation in fluorescence intensity of a sensor layer with temperature. The RF field sensors operate using a passive circuit that converts the RF field into an optical signal that is measured remotely. Both sensors have been demonstrated in high power microwave lab tests. RF sensor operability has been demonstrated for fields in the range of 0.4 - 8.9 W/cm2, while the temperature sensor has been demonstrated over the 30 - 60°C temperature range.