Gerald DeJean

Rethinking Indoor Wireless Mesh Design: Low Power, Low Frequency, Full-Duplex

Existing indoor WiFi networks in the 2.5GHz and 5 GHz use too much transmit power, needed because the high carrier frequency limits signal penetration and connectivity. Instead, we propose a novel indoor wireless mesh design paradigm, based on Low Frequency, using the newly freed white spaces previously used as analogue TV bands, and Low Power - 100 times less power than currently used. Preliminary experiments show that this maintains a similar level of connectivity and performance to existing networks. It also yields more uniform connectivity, thus simplifies MAC and routing protocol design. We also advocate full-duplex networking in a single band, which becomes possible in this setting (because we operate at low frequencies). It potentially doubles the throughput of each link and eliminates hidden terminals.

A New High-Gain Microstrip Yagi Array Antenna With a High Front-to-Back (F/B) Ratio for WLAN and Millimeter-Wave Applications

A new printed microstrip Yagi array antenna is proposed that can achieve a high gain and low backside radiation for various applications up to the millimeter-wave frequency range. The high front-to-back (F/B) ratio (up to 15 dB) is attributed to the constructive interference that takes place between the individual printed Yagi arrays in the design. Through the spacing of the elements, the directivity (between 9-11.5 dBi) and the F/B ratio can be altered to suit the application of interest. The operational principles of this design are discussed to give insight on the radiation mechanism of the antenna. An initial design at around 32.5 GHz is presented to show the performance capabilities of this configuration. An impedance bandwidth of 8.3% can be achieved around this frequency. Then, a parametric analysis is conducted to estimate the significance of the design parameters that affect the antennas performance. Finally, measured return loss and radiation pattern performance at 5.2 GHz is displayed to validate the principles and simulated results of the design. The measured impedance bandwidth of 10% is achieved. The F/B ratio is 15 dB which is larger than values previously published by 5-10 dB. Additionally, a gain of 10.7 dBi is observed. To the authors knowledge, this is the first microstrip Yagi array antenna presented that has a high gain and a high F/B ratio designed using simple fabrication techniques

3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and /spl mu/BGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2/spl times/1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75/spl times/35/spl times/0.2 mm/sup 3/) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-integrated RF and mm wave functions and modules.

A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies

This paper presents a compact system-on-package-based front-end solution for 60-GHz-band wireless communication/sensor applications that consists of fully integrated three-dimensional (3-D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication, and testing of V-band (receiver (Rx): 59-61.5 GHz, transmitter (Tx): 61.5-64 GHz) transceiver front-end module using multilayer low-temperature co-fired ceramic technology. Vertically stacked 3-D low-loss cavity bandpass filters are developed for Rx and Tx channels to realize a fully integrated compact duplexer. Each filter exhibits excellent performance (Rx: IL<2.37 dB, 3-dB bandwidth (BW) /spl sim/3.5%, Tx: IL<2.39 dB, 3-dB BW /spl sim/3.33%). The fabrication tolerances contributing to the resonant frequency experimental downshift were investigated and taken into account in the simulations of the rest devices. The developed cavity filters are utilized to realize the compact duplexers by using microstrip T-junctions. This integrated duplexer shows Rx/Tx BW of 4.20% and 2.66% and insertion loss of 2.22 and 2.48 dB, respectively. The different experimental results of the duplexer compared to the individual filters above are attributed to the fabrication tolerance, especially on microstrip T-junctions. The measured channel-to-channel isolation is better than 35.2 dB across the Rx band (56-58.4 GHz) and better than 38.4 dB across the Tx band (59.3-60.9 GHz). The reported fully integrated Rx and Tx filters and the dual-polarized cross-shaped patch antenna functions demonstrate a novel 3-D deployment of embedded components equipped with an air cavity on the top. The excellent overall performance of the full integrated module is verified through the 10-dB BW of 2.4 GHz (/spl sim/4.18%) at 57.45 and 2.3 GHz (/spl sim/3.84%) at 59.85 GHz and the measured isolation better than 49 dB across the Rx band and better than 51.9 dB across the Tx band.

Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology

In this paper, we demonstrate the development of advanced three-dimensional (3-D) low-temperature co-fired ceramic (LTCC) system-on-package (SOP) passive components for compact low-cost millimeter-wave wireless front-end modules. Numerous miniaturized easy-to-design passive circuits that can be used as critical building blocks for millimeter-wave SOP modules have hereby been realized with high-performance and high-integration potential. One miniaturized slotted-patch resonator has been designed by the optimal use of vertical coupling mechanism and transverse cuts and has been utilized to realize compact duplexers (39.8/59 GHz) and three- and five-pole bandpass filters by the novel 3-D (vertical and parallel) deployment of single-mode patch resonators. Measured results agree very well with the simulated data. One multiplexing filter, called the directional channel-separation filter, that can also be used in mixer applications shows insertion loss of <3 dB over the bandpass frequency band and a rejection /spl sim/25 dB at around 38.5 GHz over the band-rejection section. LTCC fabrication limitations have been overcome by using vertical coupling mechanisms to satisfy millimeter-wave design requirements. Lastly, a double-fed cross-shaped microstrip antenna has been designed for the purpose of doubling the data throughput by means of a dual-polarized wireless channel, covering the band between 59-64 GHz. This antenna can be easily integrated into a wireless millimeter-wave link system.

Development and analysis of a folded shorted-patch antenna with reduced size

The length of a wall-shorted rectangular patch antenna can be reduced from /spl sim//spl lambda//sub 0//4 to /spl sim//spl lambda//sub 0//8 by a simple folding operation, which results in a stacked shorted-patch (S-P) structure with a resonant frequency that can be controlled by modifying the distance between the stacked (lower and upper) shorted-patches. A theoretical analysis based on a simple transmission-line model is presented and compared with numerical simulations, showing good agreement if the height of the folded patch is much smaller than the patch length. The physical insight of the variation of the resonant frequency for this reduced-size antenna can be understood by considering the antenna as a shorted patch loaded with a capacitor. An experimental verification is carried out for a 15 mm/spl times/15 mm/spl times/6 mm folded S-P antenna prototype designed for the 2.4 GHz ISM band that can achieve a 10-dB return loss bandwidth of 4% and results in a nearly omni-directional radiation pattern.

Design of compact stacked-patch antennas in LTCC multilayer packaging modules for wireless applications

A simple procedure for the design of compact stacked-patch antennas is presented based on LTCC multilayer packaging technology. The advantage of this topology is that only one parameter, i.e., the substrate thickness (or equivalently the number of LTCC layers), needs to be adjusted in order to achieve an optimized bandwidth performance. The validity of the new design strategy is verified through applying it to practical compact antenna design for several wireless communication bands, including ISM 2.4-GHz band, IEEE 802.11a 5.8-GHz, and LMDS 28-GHz band. It is shown that a 10-dB return-loss bandwidth of 7% can be achieved for the LTCC (/spl epsiv//sub r/=5.6) multilayer structure with a thickness of less than 0.03 wavelengths, which can be realized using a different number of laminated layers for different frequencies (e.g., three layers for the 28-GHz band).

Radiation-pattern improvement of patch antennas on a large-size substrate using a compact soft-surface structure and its realization on LTCC multilayer technology

The radiation performance of patch antennas on a large-size substrate can be significantly degraded by the diffraction of surface waves at the edge of the substrate. Most of modern techniques for the surface-wave suppression are related to periodic structures, such as photonic bandgap (PBG) or electromagnetic bandgap (EBG) geometries, which require complicated processes and considerable area. The concept of artificially soft surfaces has been proposed to suppress the surface-wave propagation since the 1990s. However, the typical corrugated soft surface only applies to a substrate whose thickness is one quarter guided wavelength. A compact soft-surface structure consisting of a square ring of short-circuited metal strips is employed to surround the patch antenna for blocking the surface-wave propagation, thus, alleviating the effect of the edge diffraction and, hence, improving the radiation pattern. Since its operating frequency is determined by the width of the metal strip (about a quarter guided wavelength), the compact soft-surface structure is suitable for a substrate with arbitrary thickness and dielectric constant. More importantly, the compact soft surface can be realized on any via metallization incorporated packaging process, such as liquid crystal polymer (LCP), multilayer organic (MLO), or low temperature cofired ceramic (LTCC) technology. A numerical investigation for a patch antenna surrounded by an ideal compact soft surface is presented and the feasibility of its implementation on LTCC technology is demonstrated. It is shown that the gain at broadside of a patch antenna on a thick and large-size substrate can be increased to near 9 dBi through the use of the proposed compact soft-surface structure.

Investigation of circularly polarized loop antennas with a parasitic element for bandwidth enhancement

It is demonstrated that the bandwidth of circular polarization (CP) can be significantly increased when one more parasitic loop is added inside the original loop. A single-loop antenna has only one minimum axial ratio (AR) point while the two-loop antenna can create two minimum AR points. An appropriate combination of the two minimum AR points results in a significant enhancement for the CP bandwidth. A comprehensive study of the new type of broad-band circularly polarized antennas is presented. Several loop configurations, including a circular loop, a rhombic loop, and a dual rhombic loop with a series feed and a parallel feed, are investigated. The AR (/spl les/2 dB) bandwidth of the circular-loop antenna with a parasitic circular loop is found to be 20%, more than three times the AR bandwidth of a single loop. For the rhombic-loop antenna with a parasitic rhombic loop, an AR bandwidth (AR/spl les/2dB) of more than 40% can be achieved by changing the rhombus vertex angle. The AR (/spl les/2 dB) bandwidths of the series-fed and parallel-fed dual rhombic-loop antennas with a parasitic element are 30% and 50%, respectively. A broad-band balun is incorporated into the series-fed dual rhombic-loop antenna for impedance matching. The broad-band CP performance of the loop antennas is verified by experimental results.

A Non-invasive Wearable Neck-Cuff System for Real-Time Sleep Monitoring

Sleep is an important part of our lives which affects many life factors such as memory, learning, metabolism and the immune system. Researchers have found correlations between sleep and several diseases such as Chronic Obstructive Pulmonary disease, Chronic Heart Failure, Alzheimers disease, etc. However, sleep data is mainly recorded and diagnosed in sleep labs or in hospitals for some critical cases with high costs. In this work we develop a non-invasive, wearable neck-cuff system capable of real-time monitoring and visualization of physiological signals. These signals are generated from various sensors housed in a soft neck-worn collar and sent via Bluetooth to a cell phone which stores the data. This data is processed and reported to the user or uploaded to the cloud and/or to a local PC. With this system we are able to monitor peoples sleep continuously in a non-invasive and low cost method while at the same time collect a large database for sleep data which may benefit future advances in new findings and possibly enable a diagnosis of other diseases. We show as one of the applications of our system the possible detection of obstructive sleep apnea which is a common sleep disorder.