Gerhard Steinberger

MultiPlate- from wafer to panel-new solutions for electrolytic cu deposition in advanced packaging

Next generation technologies require an adaptation of the advanced packaging industry. Our industry has to answer the question of how to meet these new challenges such as i) plating copper (Cu) redistribution layers (RDL) of less than 5μm line and space (L/S) in volumes without significant yield losses and ii) plating Cu pillars with much higher speed than current systems. This will require new technology solutions. Currently, there are mainly two different strategies in the industry to cope with these challenges: a) Fan Out Wafer Level Packaging (FOWLP) solutions, such as TSMCs Integrated Fan Out Technology (InFO) and Amkors Silicon Wafer Integrated Fan Out Technology (SWIFT) packages and b) Panel level solutions using new materials like glass, or new embedding processes are also coming to the market.