Giancarlo Corradini
École Polytechnique Fédérale de Lausanne
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Featured researches published by Giancarlo Corradini.
Research in Microelectronics and Electronics, 2005 PhD | 2005
Hansu Birol; Thomas Maeder; Marc Boers; Caroline Jacq; Giancarlo Corradini; Peter Ryser
Fabrication of a millinewton force sensor, which is based on LTCC technology as an alternative to the widely used alumina (Al2O3) is described. The new sensor, integrated with piezoresistor thick-film, has shown an increase in the sensitivity by two times compared to the alumina-based version in the first attempt. This is ascribed to the smaller elastic modulus and finer substrate thickness attainable by LTCC. Moreover design flexibility is also an important factor, which contributes to the increased sensitivity of the sensor. It is strongly expected that the device performance can further be improved, by modifying the co-fired LTCC components such as LTCC tape and the thick-film terminations.
Key Engineering Materials | 2007
Hansu Birol; Thomas Maeder; Caroline Jacq; Giancarlo Corradini; Marc Boers; Sigfrid Straessler; Peter Ryser
The purpose of this paper is to demonstrate sensors and structures fabricated using the LTCC technology, which has been addressed and employed increasingly as a smart packaging approach for several applications. The focus will be on inclination and cantilever force sensors and micro-fluidic structures. Motivation for selection of LTCC for these applications in addition to fabrication and structuring of the devices will be explained in details. TGA (thermo-gravimetric analysis), dilatometer analysis, SEM (scanning electron microscopy), electronic equipment for measuring sensor performance will be extensively used for explanation of the results. It will also be shown that, compared to classical thick-film technology on alumina, LTCC allows a considerable increase in sensitivity, and is therefore better suited for the sensing of minute forces and pressures.
XXIX International Conference of IMAPS Poland | 2005
Thomas Maeder; Vincent Fahrny; Sven Nico Stauss; Giancarlo Corradini; Peter Ryser
1st International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) | 2005
Hansu Birol; Thomas Maeder; Caroline Jacq; Giancarlo Corradini; Reynald Passerini; Yannick Fournier; Sigfrid Strässler; Peter Ryser
XXIX International Conference of IMAPS Poland, Koszalin | 2005
Hansu Birol; Marc Boers; Thomas Maeder; Giancarlo Corradini; Peter Ryser
Proceedings, Ceramic Interconnect and Ceramic Microsystems Technologies, Munich (DE) | 2008
Caroline Jacq; Thomas Maeder; Niklaus Johner; Giancarlo Corradini; Peter Ryser
Microelectronics Reliability | 2008
Thomas Maeder; Grégory Affolter; Niklaus Johner; Giancarlo Corradini; Peter Ryser
european microelectronics and packaging conference | 2005
Thomas Maeder; Caroline Jacq; Giancarlo Corradini; Peter Ryser
european microelectronics and packaging conference | 2007
Caroline Jacq; Thomas Maeder; Niklaus Johner; Giancarlo Corradini; Peter Ryser
4th European Microelectronics and Packaging Symposium - IMAPS | 2006
Thomas Maeder; Caroline Jacq; Igor Saglini; Giancarlo Corradini; Sigfrid Strässler; Hansu Birol; Peter Ryser