Marc Boers
École Polytechnique Fédérale de Lausanne
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Publication
Featured researches published by Marc Boers.
IEEE\/ASME Journal of Microelectromechanical Systems | 2009
Adit Decharat; Junchun Yu; Marc Boers; Göran Stemme; Frank Niklaus
In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of microcavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.
international conference on micro electro mechanical systems | 2007
André Mercanzini; Karen C. Cheung; Derek L. Buhl; Marc Boers; Anne Maillard; Philippe Colin; Jean-Charles Bensadoun; Arnaud Bertsch; Alan Carleton; Philippe Renaud
We present the fabrication, characterization, use in cortical recording and histological results of a flexible implantable neural probe. The device is microfabricated in polyimide and platinum, allowing for greater flexibility. It incorporates two layers of platinum electrodes, which greatly reduces the size of neural probes and limits the insertion damage. In recording experiments, acute in-vivo measurements were performed in the mouse cortex. Local field potential, single- and multi-neuron activity were simultaneously recorded. We demonstrate using immunohistochemistry techniques reduced inflammation at the implantation site for microfabricated polyimide neural probes. We therefore show that the major advantage of using polymer probes over silicon probes is the reduced damage due to insertion and probe-brain compliance mismatch.
international conference on micro electro mechanical systems | 2007
Adit Decharat; Marc Boers; Frank Niklaus; Göran Stemme
In this paper we present for the first time a wafer-to-wafer attachment and sealing method for wafer level manufacturing of micro-cavities using a room temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs and their impact on the resulting bonds. Experiments are performed to evaluate the sealing properties against liquids and vapors of the different sealing ring structures.
Research in Microelectronics and Electronics, 2005 PhD | 2005
Hansu Birol; Thomas Maeder; Marc Boers; Caroline Jacq; Giancarlo Corradini; Peter Ryser
Fabrication of a millinewton force sensor, which is based on LTCC technology as an alternative to the widely used alumina (Al2O3) is described. The new sensor, integrated with piezoresistor thick-film, has shown an increase in the sensitivity by two times compared to the alumina-based version in the first attempt. This is ascribed to the smaller elastic modulus and finer substrate thickness attainable by LTCC. Moreover design flexibility is also an important factor, which contributes to the increased sensitivity of the sensor. It is strongly expected that the device performance can further be improved, by modifying the co-fired LTCC components such as LTCC tape and the thick-film terminations.
Key Engineering Materials | 2007
Hansu Birol; Thomas Maeder; Caroline Jacq; Giancarlo Corradini; Marc Boers; Sigfrid Straessler; Peter Ryser
The purpose of this paper is to demonstrate sensors and structures fabricated using the LTCC technology, which has been addressed and employed increasingly as a smart packaging approach for several applications. The focus will be on inclination and cantilever force sensors and micro-fluidic structures. Motivation for selection of LTCC for these applications in addition to fabrication and structuring of the devices will be explained in details. TGA (thermo-gravimetric analysis), dilatometer analysis, SEM (scanning electron microscopy), electronic equipment for measuring sensor performance will be extensively used for explanation of the results. It will also be shown that, compared to classical thick-film technology on alumina, LTCC allows a considerable increase in sensitivity, and is therefore better suited for the sensing of minute forces and pressures.
Sensors and Actuators A-physical | 2008
André Mercanzini; Karen C. Cheung; Derek L. Buhl; Marc Boers; Anne Maillard; Philippe Colin; Jean-Charles Bensadoun; Arnaud Bertsch; Philippe Renaud
Sensors and Actuators A-physical | 2007
Hansu Birol; Thomas Maeder; Ingo Nadzeyka; Marc Boers; Peter Ryser
XXIX International Conference of IMAPS Poland, Koszalin | 2005
Hansu Birol; Marc Boers; Thomas Maeder; Giancarlo Corradini; Peter Ryser
Archive | 2014
André Mercanzini; Alain Jordan; Alexandre Michalis; Marc Boers; Alain Dransart
Archive | 2017
Ingo Hartig; André Mercanzini; Alain Jordan; Alexandre Michalis; Marc Boers; Alain Dransart