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Dive into the research topics where Gobinda Das is active.

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Featured researches published by Gobinda Das.


Archive | 2001

Wafer-Level Test

Gobinda Das; Eugene R. Atwood

Successful development and manufacture of semiconductor components is highly dependent on test verification at several critical steps throughout the process and at multiple levels of packaging. An effective test methodology spans a broad range of products, diverse test systems and product-handling equipment, and encompasses several test techniques. A reliable and cost-effective product contacting method is a key requirement for all of these test techniques to be successful.


Archive | 2004

Tfi probe i/o wrap test method

Gobinda Das


Journal of Applied Physics | 1973

Precipitation of copper in silicon

Gobinda Das


Archive | 1991

Metal bump for a thermal compression bond and method for making same

Erich Berndlmaier; Gobinda Das; Thomas L. Viau


Archive | 1998

Gray scale etching for thin flexible interposer

Ernest Bassous; Gobinda Das; Frank D. Egitto; Natalie B. Feilchenfeld; Elizabeth Foster; Stephen Joseph Fuerniss; James Steven Kamperman; Donald Joseph Mikalsen; Michael R. Scheuermann; David B. Stone


Archive | 1998

Multi-layer ceramic substrate decoupling

Charles J. Blasi; Gobinda Das


Archive | 1976

Semiconductor fabrication method for improved device yield by minimizing pipes between common conductivity type regions

Klaus Dietrich Beyer; Gobinda Das; Michael Robert Poponiak; Tsu-Hsing Yeh


Archive | 1998

Off-axis contact tip and dense packing design for a fine pitch probe

Gobinda Das; Steven J. Duda; Paul M. Gaschke


Archive | 1998

Wafer probe interface arrangement with nonresilient probe elements and support structure

Gobinda Das; Steven J. Duda; Paul M. Gaschke; Angelo M. Giaimo; Frederick L. Taber; John Vetrero


Archive | 2012

Techniques for improving bond pad performance

Frederic Beaulieu; Gobinda Das; Steven J. Duda; Matthew J. Farinelli; Adreanne Kelly; Samuel Roy McKnight; William J. Murphy

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