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Paul M. Gaschke

IBM

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Publication

Featured researches published by Paul M. Gaschke.

Archive | 1999

Segmented architecture for wafer test and burn-in

Thomas W. Bachelder; Dennis R. Barringer; Dennis R. Conti; James M. Crafts; David L. Gardell; Paul M. Gaschke; Mark Raymond Laforce; Charles Hampton Perry; Roger R. Schmidt; Joseph John Van Horn; Wade H. White

Archive | 1998

Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing

Ethan E. Gallagher; David L. Gardell; Paul M. Gaschke

Archive | 1991

Liquid film interface cooling chuck for semiconductor wafer processing.

Santiago Ernesto Del Puerto; Paul M. Gaschke

Archive | 1997

Large area multiple-chip probe assembly and method of making the same

Gobina Das; Paul M. Gaschke; Suryanarayan G. Hegde; Mark Raymond Laforce; Dale McHerron; Charles Hampton Perry; Frederick L. Taber

Archive | 1998

Off-axis contact tip and dense packing design for a fine pitch probe

Gobinda Das; Steven J. Duda; Paul M. Gaschke

Archive | 2005

METHOD AND APPARATUS FOR TEMPORARY THERMAL COUPLING OF AN ELECTRONIC DEVICE TO A HEAT SINK DURING TEST

Paul J. Aube; Normand Cote; Roger G. Gamache; David L. Gardell; Paul M. Gaschke; Marc D. Knox; Denis D. Turcotte

Archive | 1998

Universal test and burn-in socket adaptable to varying IC module thickness

Paul M. Gaschke

Archive | 1998

Wafer probe interface arrangement with nonresilient probe elements and support structure

Gobinda Das; Steven J. Duda; Paul M. Gaschke; Angelo M. Giaimo; Frederick L. Taber; John Vetrero

Archive | 2003

High power space transformer

Paul M. Gaschke

Archive | 1999

Vertical probe housing

Paul M. Gaschke

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David L. Gardell

IBM

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Charles Hampton Perry

IBM

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Denis D. Turcotte

IBM

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Frederick L. Taber

IBM

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Gobinda Das

IBM

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Marc D. Knox

IBM

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Mark Raymond Laforce

IBM

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Normand Cote

IBM

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Paul J. Aube

IBM

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Roger G. Gamache

IBM

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