Gregory Nellis

A Numerical Model of an Active Magnetic Regenerator Refrigeration System

Active magnetic regenerative refrigeration (AMRR) systems represent an environmentally attractive space cooling and refrigeration alternative that do not use a fluorocarbon working fluid. Two recent developments have made AMRR’s feasible in the near-term. A rotary regenerator bed utilizing practical and affordable permanent magnets has been demonstrated and shown to achieve a reasonable coefficient of performance (COP). Concurrently, families of magnetocaloric material alloys with adjustable Curie temperatures have been developed. Using these materials, it is possible to construct a layered regenerator bed that can achieve a high magnetocaloric effect across its entire operating range. This paper describes a numerical model capable of predicting the practical limits of the performance of this technology applied to space conditioning and refrigeration. The model treats the regenerator bed as a one dimensional matrix of magnetic material with a spatial variation in Curie temperature, and therefore magnetic properties. The matrix is subjected to a spatially and temporally varying magnetic field and fluid mass flow rate. The variation of these forcing functions is based on the implementation of a rotating, multiple bed configuration. The numerical model is solved using a fully implicit (in time and space) discretization of the governing energy equations. The nonlinear aspects of the governing equations (e.g., fluid and magnetic property variations) are handled using a relaxation technique. Some preliminary modeling results are presented which illustrate how an AMRR system can be optimized for a particular operating condition. The performance of the AMRR in a space cooling application with the layered vs non-layered bed is compared to current vapor compression technology.

Inertance Tube Optimization for Pulse Tube Refrigerators

The efficiency of regenerative refrigerators is generally maximized when the pressure and flow are in phase near the midpoint of the regenerator. Such a phase relationship minimizes the amplitude of the mass flow for a given acoustic power flow through the regenerator. To achieve this phase relationship in a pulse tube refrigerator requires that the flow at the warm end of the pulse tube lag the pressure by about 60 degrees. The inertance tube allows for the flow to lag the pressure, but such a large phase shift is only possible with relatively large acoustic power flows. In small pulse tube cryocoolers the efficiency is improved by maximizing the phase shift in the inertance tube. This paper describes a simple transmission line model of the inertance tube, which is used to find the maximum phase shift and the corresponding diameter and length of the optimized inertance tube. Acoustic power flows between 1 and 100 W are considered in this study, though the model may be valid for larger systems as well. Fo...

Design Considerations for Supercritical Carbon Dioxide Brayton Cycles With Recompression

Supercritical carbon dioxide (SCO2) Brayton cycles have the potential to offer improved thermal-to-electric conversion efficiency for utility scale electricity production. These cycles have generated considerable interest in recent years because of this potential and are being considered for a range of applications, including nuclear and concentrating solar power (CSP). Two promising SCO2 power cycle variations are the simple Brayton cycle with recuperation and the recompression cycle. The models described in this paper are appropriate for the analysis and optimization of both cycle configurations under a range of design conditions. The recuperators in the cycle are modeled assuming a constant heat exchanger conductance value, which allows for computationally efficient optimization of the cycle’s design parameters while accounting for the rapidly varying fluid properties of carbon dioxide near its critical point. Representing the recuperators using conductance, rather than effectiveness, allows for a more appropriate comparison among design-point conditions because a larger conductance typically corresponds more directly to a physically larger and higher capital cost heat exchanger. The model is used to explore the relationship between recuperator size and heat rejection temperature of the cycle, specifically in regard to maximizing thermal efficiency. The results presented in this paper are normalized by net power output and may be applied to cycles of any size. Under the design conditions considered for this analysis, results indicate that increasing the design high-side (compressor outlet) pressure does not always correspond to higher cycle thermal efficiency. Rather, there is an optimal compressor outlet pressure that is dependent on the recuperator size and operating temperatures of the cycle and is typically in the range of 30–35 MPa. Model results also indicate that the efficiency degradation associated with warmer heat rejection temperatures (e.g., in dry-cooled applications) are reduced by increasing the compressor inlet pressure. Because the optimal design of a cycle depends upon a number of application-specific variables, the model presented in this paper is available online and is envisioned as a building block for more complex and specific simulations. [DOI: 10.1115/1.4027936]

Effectiveness-NTU relationship for a counterflow heat exchanger subjected to an external heat transfer

This paper presents the analytical solution for the effectiveness of a counterflow heat exchanger subjected to a uniformly distributed, external heat flux. The solution is verified against conventional e-NTU relations in the limit of zero external heat flux. This situation is of interest in applications such as cryogenic and process engineering, and the analytical solution provides a convenient method for treating differential elements of a heat exchanger in a numerical model.

Optimization of the Composition of a Gas Mixture in a Joule-Thomson Cycle

Mixed gas working fluids can be used within Joule-Thomson devices to achieve a greater refrigeration effect than is possible with a pure substance. Lower temperatures and higher cooling powers can be obtained with appropriate mixtures, resulting in lower operating pressures and mass flow rates. This paper describes a computational tool that allows the composition of gas mixtures to be optimized for a particular operating condition. Automated optimization algorithms are described, evaluated, and validated for two- and three-component mixtures consisting of nitrogen and various hydrocarbons. A genetic optimization algorithm was found to be the most robust and reliable technique and was adapted to this application. Subsequently, the optimization space was extended to a larger number of components for a range of load temperatures and operating pressures. The performance of optimized hydrocarbon gas mixtures is compared with that of nonflammable hydrofluorocarbon mixtures for a range of load temperatures and supply pressures.

Measurements of the dynamic contact angle for conditions relevant to immersion lithography

The semiconductor industry has used optical lithography to create impressively small features. However, the resolution of optical lithography is approaching limits based on light wavelength and numerical aperture. Immersion lithography is a means to extend the resolution by inserting a liquid with a high index of refraction between the lens and wafer. This enables the use of higher numerical aperture optics. Several engineering obstacles must be overcome before immersion lithography can be used on an industry-wide scale. One such challenge is the deposition of the immersion liquid onto the wafer during the scanning process; any residual liquid left on the wafer is a potential defect mechanism. The residual liquid deposition is controlled by the details of the fluid management system, and is strongly dependent on the three-phase contact line. Therefore, this work concentrates on understanding the behavior of this contact line, specifically by measuring the dynamic contact angle and the critical velocity for liquid deposition. A contact angle measurement technique is developed and verified; the technique is subsequently applied to measure the dynamic advancing and receding contact angle for a series of resist-covered surfaces under conditions that are relevant to immersion lithography.

A piezoelectric microvalve for cryogenic applications

This paper reports on a normally open piezoelectrically actuated microvalve for high flow modulation at cryogenic temperatures. One application envisioned is to control the flow of a cryogen for distributed cooling with a high degree of temperature stability and a small thermal gradient. The valve consists of a micromachined die fabricated from a silicon-on-insulator wafer, a glass wafer, a commercially available piezoelectric stack actuator and Macor TM ceramic encapsulation that has overall dimensions of 1 × 1 × 1c m 3 .A perimeter augmentation scheme for the valve seat has been implemented to provide high flow modulation. In tests performed at room temperature the flow was modulated from 980 mL min −1 with the valve fully open (0 V), to 0 mL min −1 with a 60 V actuation voltage, at an inlet gauge pressure of 55 kPa. This range is orders of magnitude higher flow than the modulation capability of similarly sized piezoelectric microvalves. At the cryogenic temperature of 80 K, the valve successfully modulated gas flow from 350 mL min −1 down to 20 mL min −1 with an inlet pressure of 104 kPa higher than the atmosphere. The operation of this valve has been validated at elevated temperatures as well, up to 380 K. The valve has a response time of less than 1 ms and has operational bandwidth up to 820 kHz. (Some figures in this article are in colour only in the electronic version)

Double-sided IPEM cooling using miniature heat pipes

Integrated power electronic module (IPEM) planar interconnect technologies offer opportunities for improved thermal management by allowing thermal access to the upper side of the power devices. In this paper, the feasibility of using miniature heat pipes to achieve effective double-sided cooling is investigated by analyzing the complete thermal circuit associated with the power device. A nominal case was modeled using the ANSYS(tm) finite element software in a single-sided and double-sided configuration. The numerical model predicted that the double-sided configuration would result in a 13/spl deg/C reduction in the maximum temperature compared to the single-sided case, for the same 100 W/cm/sup 2/ power dissipation in the semiconductor die. This corresponds to a 15% decrease in the maximum temperature rise relative to ambient or a similar increase in allowable power dissipation. Twenty-eight percent of the heat was removed from the upper side of the IPEM in the double-sided case. An additional benefit associated with double-sided cooling was a significant reduction in the spatial temperature gradients along the surface of the IPEM which would translate to lower thermally induced stress and higher reliability. The sensitivity of the numerical predictions to important parameters; including the dielectric conductivity, contact conductance, and heat sink characteristics are numerically investigated. An experimental fixture was fabricated and used to measure a miniature rectangular heat pipes performance characteristics and the solder joint resistance at its evaporator and condenser interfaces in order to validate the numerical model inputs and demonstrate the required heat pipe capacity. The tested heat pipe was limited to approximately 80 W/cm/sup 2/ heat flux in a vertical, evaporator-over-condenser orientation. This limit was not observed in a vertical, gravity-assisted orientation for applied heat flux up to 125 W/cm/sup 2/. Equivalent heat pipe resistances of approximately 0.12 and 0.08 K/W were measured in these orientations, respectively. The contact resistance of the indium solder joint was measured and found to be approximately 0.1 cm/sup 2//spl middot/K/W.

A Microvalve With Integrated Sensors and Customizable Normal State for Low-Temperature Operation

This paper reports on design, fabrication, and testing of a piezoelectrically actuated microvalve with integrated sensors for flow modulation at low temperatures. One envisioned application is to control the flow of a cryogen for distributed cooling with a high degree of temperature stability and a small thermal gradient. The valve consists of a micromachined die fabricated from a silicon-on-insulator wafer, a glass wafer, a commercially available piezoelectric stack actuator, and Macor ceramic encapsulation that has overall dimensions of 1.5 x 1.5 x 1.1 cm3. A piezoresistive pressure sensor and a thin-film Pt resistance temperature detector are integrated on the silicon die. The assembly process allows the implementation of normally open, partially open, and normally closed valves. At room temperature, gas flow modulation from 200 to 0 mL/min is achieved from 0- to 40-V actuation. Flow modulation at various temperatures from room temperature to 205 K is also reported. The pressure sensor has sensitivity of 356 ppm/kPa at room temperature, with temperature coefficient of sensitivity of -6507 ppm/K. The temperature sensor has sensitivity of 0.29 %/K. The valve and the sensors are tested across a wide range of temperatures, and the effect of temperature on performance is discussed.

An Experimentally Validated Numerical Modeling Technique for Perforated Plate Heat Exchangers

Cryogenic and high-temperature systems often require compact heat exchangers with a high resistance to axial conduction in order to control the heat transfer induced by axial temperature differences. One attractive design for such applications is a perforated plate heat exchanger that utilizes high conductivity perforated plates to provide the stream-to-stream heat transfer and low conductivity spacers to prevent axial conduction between the perforated plates. This paper presents a numerical model of a perforated plate heat exchanger that accounts for axial conduction, external parasitic heat loads, variable fluid and material properties, and conduction to and from the ends of the heat exchanger. The numerical model is validated by experimentally testing several perforated plate heat exchangers that are fabricated using microelectromechanical systems based manufacturing methods. This type of heat exchanger was investigated for potential use in a cryosurgical probe. One of these heat exchangers included perforated plates with integrated platinum resistance thermometers. These plates provided in situ measurements of the internal temperature distribution in addition to the temperature, pressure, and flow rate measured at the inlet and exit ports of the device. The platinum wires were deposited between the fluid passages on the perforated plate and are used to measure the temperature at the interface between the wall material and the flowing fluid. The experimental testing demonstrates the ability of the numerical model to accurately predict both the overall performance and the internal temperature distribution of perforated plate heat exchangers over a range of geometry and operating conditions. The parameters that were varied include the axial length, temperature range, mass flow rate, and working fluid.