Gyu-hwan Kwag

Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing

Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device

Methods for performing plasma etching operations on microelectronic structures

Method of manufacturing semiconductor devices, etching composition for manufacturing semiconductor devices, and semiconductor devices made using the method

Apparatus for wafer treatment for the manufacture of semiconductor devices

Circulation system for supplying chemical for manufacturing semiconductor devices and circulating method thereof

Wet-etching facility for manufacturing semiconductor devices

Sputtering apparatus having a target backing plate equipped with a cooling line and sputtering method using the same

Wafer dryer comprising revolving spray nozzle and method for drying wafers using the same

Semiconductor device, especially a multilayer circuit structure, production process