Hajime Sudo

Electrostatic linear microactuator mechanism for focusing a CCD camera

A newly developed linear electrostatic microactuator mechanism employing a vibrating motion is described. In order to achieve a miniature charge coupled device (CCD) camera with autofocusing and zoom functions, we developed an electrostatic linear microactuator with a large movement range. In miniature CCD cameras, extremely thin electrostatic actuators are needed because the space available for the focusing mechanism is reduced. The moving part (slider) of this actuator is sandwiched between fixed electrodes (stator), is alternately attached and detached to these fixed electrodes, and actuates linearly on a macroscopic level. The fundamental feasibility of this vibrating motion mechanism was first confirmed in experiments. This actuator was then applied to the focusing mechanism of a miniature CCD camera. A microlens was fitted inside the slider and it was possible to adjust the focus by moving the slider (with microlens). The size of the prototype for the focusing mechanism is 3.6/spl times/4.6/spl times/8.0 mm, and a 2-mm movement range is achieved. The minimum driving voltage is 60 V and the maximum velocity is 1.0 min/s.

High-density 3-D packaging technology based on the sidewall interconnection method and its application for CCD micro-camera visual inspection system

High-density three-dimensional (3-D) packaging technology for a charge coupled device (CCD) micro-camera visual inspection system module has been developed by applying high-density interconnection stacked unit modules. The stacked unit modules have fine-pitch flip-chip interconnections within Cu-column-based solder bumps and high-aspect-ratio Cu sidewall footprints for vertical interconnections. Cu-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump so as to achieve fine-pitch flip-chip interconnection with high-reliability. High-aspect-ratio Cu sidewall footprints were realized by the Cu-filled stacked vias at the edge of the substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stacked unit substrates simultaneously. The fabricated high-density 3-D packaging module has operated satisfactorily as the CCD imaging data transmission circuit. The technology was confirmed to be effective for incorporating many large scale integrated (LSI) devices of different sizes at far higher packaging density than it is possible to attain using conventional technology. This paper describes the high-density 3-D packaging technology which enables all of the CCD imaging data transmission circuit devices to be packaged into the restricted space of the CCD micro-camera visual inspection system interior.

The Development of Quite Low Cost Disposable, Rapid, Individually Controlled Matrix (10×10) Microreactor System

We have developed a unique new matrix (10 × 10 matrix, 500 μm diameter test tube, 2 mm pitch, within 20×20 mm area) microreactor system which is not only fast but also individually controllable. This reactor system can perform 100 different kinds of processes in parallel more quickly than is possible with any conventional microreactor with quite lower cost due to the use of disposable sheet.

High-density 3D packaging technology for CCD micro-camera system module

High-density three-dimensional (3D) packaging technology for a CCD micro-camera system module has been developed by applying high-density interconnection stack-unit modules that have fine-pitch flip-chip interconnections within copper-column-based solder bumps and high-aspect-ratio sidewall footprints for vertical interconnections. Copper-column-based solder bump design and underfill encapsulation resin characteristics were optimized to reduce the strain in the bump and to achieve fine-pitch flip-chip interconnection with high reliability. High-aspect-ratio sidewall footprints were realized by the copper-filled stacked vias at the edge of the module substrate. High-precision distribution of sidewall footprints was achieved by laminating the multiple stack-unit substrates simultaneously. The fabricated three-dimensional package has operated satisfactorily as the CCD imaging data transmission circuit module. The technology was confirmed to be effective for incorporating many devices of different sizes at far higher packaging density than it is possible to attain using conventional technology.