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Hak-kyoon Byun

Samsung

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Publication

Featured researches published by Hak-kyoon Byun.

Archive | 2008

STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Hak-kyoon Byun; Tae-hun Kim; Sang-uk Han; Jung-Do Lee; Seon-Hyang You

Archive | 2006

WIRING SUBSTRATE HAVING VARIOUSLY SIZED BALL PADS, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE, AND STACK PACKAGE USING THE SEMICONDUCTOR PACKAGE

Tae-hun Kim; Hak-kyoon Byun; Sung-Yong Park; Heung-Kyu Kwon

Archive | 2007

Multi stack package and method of fabricating the same

Hak-kyoon Byun; Tae-Je Cho; Jong-Bo Shim; Sang-uk Han

Archive | 2014

Semiconductor package and package on package having the same

Hak-kyoon Byun; Dae-young Choi; Mi-Yeon Kim

Archive | 2008

SEMICONDUCTOR DIE PICK UP APPARATUS AND METHOD THEREOF

Hak-kyoon Byun; Hyun-jung Song; Jong-Bo Shim

Archive | 2013

METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-PACKAGE DEVICES FABRICATED BY THE SAME

ChoongBin Yim; Eun-Chul Ahn; Taesung Park; Hak-kyoon Byun; Yong-Kwan Lee

Archive | 2007

METHOD OF AND APPARATUS FOR DETACHING SEMICONDUCTOR CHIPS FROM A TAPE

Youn-Sung Ko; Hak-kyoon Byun; Jung-Hwan Woo; Hyun-jung Song

Archive | 2007

Apparatus for detaching a semiconductor chip from a tape

Youn-Sung Ko; Hak-kyoon Byun; Jung-Hwan Woo; Hyun-jung Song

Archive | 2012

PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB

Hak-kyoon Byun; Tae-hun Kim; Ji-Hyun Park; Byung-cheol Jeon; Seungjin Cheon

Archive | 2007

Method of dicing

Hyun-jung Song; Hak-kyoon Byun; Jong-Bo Shim; Min-ok Na

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Hyun-jung Song

Samsung

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Jong-Bo Shim

Samsung

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Tae-hun Kim

Samsung

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ChoongBin Yim

Samsung

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Eun-Chul Ahn

Samsung

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Jung-Hwan Woo

Samsung

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Sang-uk Han

Samsung

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Taesung Park

Samsung

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Yong-Kwan Lee

Samsung

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Youn-Sung Ko

Samsung

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