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Hanns-Heinz Peltz

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Publication

Featured researches published by Hanns-Heinz Peltz.

Archive | 1973

Semiconductor components having bimetallic lead connected thereto

Hanns-Heinz Peltz; Hubert Pretsch; Detlev Schmitter

Archive | 1974

Perforated plastics tape for mfr. of semiconductor elements - is a laminate comprising a base stratum, with epoxy adhesive layer, copper layer, and photo-lacquer layer

Detlev Schmitter; Hanns-Heinz Peltz

Archive | 1976

Method of producing metallic carrier system for a multi-electrode semiconductor strip

Gerhard Mitterhummer; Hanns-Heinz Peltz; Heinrich Mayer; Fritz Conzelmann

Archive | 1990

Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Juergen Bednarz; Karl-Heinz Horsmann; Ralf Dipl Ing Criens; Horst Scheffler; Hanns-Heinz Peltz

Archive | 1990

Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

Archive | 1990

Device for enclosing of electrical or electronical components or component groups and enclosing of electrical or electronical components or component groups

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

Archive | 1992

Method and an encapsulation for encapsulating electrical or electronic components or assemblies

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Juergen Bednarz; Karl-Heinz Horsmann; Ralf Dipl Ing Criens; Horst Scheffler; Hanns-Heinz Peltz

Archive | 1974

Semiautomatic semiconductor module assembly - on carrier using adhesive on aluminized plastic substrate and diamond saw cuts

Hanns-Heinz Peltz; Detlev Schmitter

Archive | 1973

Semiconductor device mounted on an epoxy substrate

Theodor Freitag; Hanns-Heinz Peltz; Hubert Pretsch; Detlev Schmitter

Archive | 1990

Dispositif pour le blindage de composants ou de groupes de composants électriques ou électroniques et blindage de composants ou de groupes de composants électriques ou électroniques

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

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Detlev Schmitter

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Hans-Fr. Dr. Schmidt

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Horst Scheffler

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Karl-Heinz Horsmann

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Siegfried Rauchmaul

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Hubert Pretsch

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Jürgen Dr. Bednarz

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Ralf Dr. Criens

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Juergen Bednarz

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Ralf Dipl Ing Criens

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