Is this you? Create Your Porfile
Avatar

Hans-Fr. Dr. Schmidt

Siemens

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Hans-Fr. Dr. Schmidt is active.

Explore More

Publication

Featured researches published by Hans-Fr. Dr. Schmidt.

Archive | 1989

Three-dimensional printed circuit board

Hans-Fr. Dr. Schmidt; Siegfried Rauchmaul; Juergen Bednarz

Archive | 1987

Method and coating material for applying electrically conductive printed patterns to insulating substrates

Juergen Frankel; Antoon Mattelin; Pol Pecceu; Ferdinand Quella; Hans-Fr. Dr. Schmidt; Luc Boone; Sybille von Tomkewitsch; Marc De Vogelaere

Archive | 1989

Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies.

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Ralf Dr. Criens

Archive | 1990

METHOD FOR APPLYING A SOLDER RESIST LAYER TO A PRINTED CIRCUIT BOARD

Hans-Fr. Dr. Schmidt; Helmut Hadwiger; Milan Prochazka; Eddy Roelants

Archive | 1990

Method for encapsulating electronic components or assemblies using a thermoplastic encapsulant

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Juergen Bednarz; Karl-Heinz Horsmann; Ralf Dipl Ing Criens; Horst Scheffler; Hanns-Heinz Peltz

Archive | 1990

Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

Archive | 1990

Device for enclosing of electrical or electronical components or component groups and enclosing of electrical or electronical components or component groups

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

Archive | 1992

Method and an encapsulation for encapsulating electrical or electronic components or assemblies

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Juergen Bednarz; Karl-Heinz Horsmann; Ralf Dipl Ing Criens; Horst Scheffler; Hanns-Heinz Peltz

Archive | 1990

Method of applying a solder stop coating on printed circuit boards

Hans-Fr. Dr. Schmidt; Helmut Hadwiger; Milan Prochazka; Eddy Roelants

Archive | 1990

Dispositif pour le blindage de composants ou de groupes de composants électriques ou électroniques et blindage de composants ou de groupes de composants électriques ou électroniques

Siegfried Rauchmaul; Hans-Fr. Dr. Schmidt; Jürgen Dr. Bednarz; Hanns-Heinz Peltz; Karl-Heinz Horsmann; Ralf Dr. Criens; Horst Scheffler

Explore More

Collaboration

Dive into the Hans-Fr. Dr. Schmidt's collaboration.

Top Co-Authors
Avatar

Siegfried Rauchmaul

Siemens

View shared research outputs
Top Co-Authors
Avatar

Hanns-Heinz Peltz

Siemens

View shared research outputs
Top Co-Authors
Avatar

Horst Scheffler

Siemens

View shared research outputs
Top Co-Authors
Avatar

Karl-Heinz Horsmann

Siemens

View shared research outputs
Top Co-Authors
Avatar

Ralf Dr. Criens

Siemens

View shared research outputs
Top Co-Authors
Avatar

Eddy Roelants

Siemens

View shared research outputs
Top Co-Authors
Avatar

Helmut Hadwiger

Siemens

View shared research outputs
Top Co-Authors
Avatar

Juergen Bednarz

Siemens

View shared research outputs
Top Co-Authors
Avatar

Jürgen Dr. Bednarz

Siemens

View shared research outputs
Top Co-Authors
Avatar

Milan Prochazka

Siemens

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge