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Dive into the research topics where Hans-Joachim Barth is active.

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Featured researches published by Hans-Joachim Barth.


Multilevel interconnect technology. Conference | 1997

Advanced PVD Ti/TiN liners for contact and via applications

Hans-Joachim Barth; J. Bierner; Hans Helneder; Werner K. Robl; K. Schober; Manfred Schneegans

The benefits of different advanced PVD methods for Ti/TiN films, collimated, longthrow and ionized PVD, are compared to conventional or standard magnetron sputtering with respect to future requirements. Special attention is given to integration aspects in combination with W- plugs and hot Al-fill techniques for contact applications. Besides basic film properties and step coverage data, electrical results for contacts are reported. The dependence of the contact resistance on the bottom Ti thickness is explained, and a new spiking model for Al-filled contacts is proposed. Finally specific manufacturing issues like throughput, target life time and defect densities will be addressed also.


Archive | 2005

Stress-relief layer for semiconductor applications

Hans-Joachim Barth; Erdem Kaltalioglu; Mark Hoinkis; Gerald Friese; Pak Leung


Archive | 2016

HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS

Hans-Joachim Barth; Reinhard Mahnkopf; Wolfgang Molzer; Harald Gossner; Christian Mueller


Archive | 2015

ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC COMPONENTS

Hans-Joachim Barth; Reinhard Mahnkopf; Sven Albers; Thorsten Meyer


Archive | 2014

Flow diversion devices

Michael Skinner; Sven Albers; Harald Gossner; Peter Baumgartner; Hans-Joachim Barth


Archive | 2017

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Thorsten Meyer; Gerald Ofner; Bernd Waidhas; Hans-Joachim Barth; Sven Albers; Reinhard Golly; Philipp Riess; Bernd Ebersberger


Archive | 2017

conjunto eletrônico que inclui componentes eletrônicos empilhados

Hans-Joachim Barth; Reinhard Mahnkopf; Sven Albers; Thorsten Meyer


Archive | 2016

STACKED MICROELECTRONIC DICE EMBEDDED IN A MICROELECTRONIC SUBSTRATE

Reinhard Mahnkopf; Wolfgang Molzer; Bernd Memmler; Edmund Goetz; Hans-Joachim Barth; Sven Albers; Thorsten Meyer


Archive | 2016

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

Reinhard Mahnkopf; Wolfgang Molzer; Bernd Memmler; Edmund Goetz; Hans-Joachim Barth; Sven Albers; Thorsten Meyer


Archive | 2015

Electronic assembly containing the stacked electronic components

Hans-Joachim Barth; Reinhard Mahnkopf; Sven Albers; Thorsten Meyer

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Wolfgang Molzer

Intel Mobile Communications

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