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Sven Albers

Intel

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Publication

Featured researches published by Sven Albers.

Archive | 2016

INTEGRATED CIRCUIT PACKAGE CONFIGURATIONS TO REDUCE STIFFNESS

Sven Albers; Sonja Koller; Thorsten Meyer; Georg Seidemann; Christian Geissler; Andreas Wolter

Archive | 2014

Flow diversion devices

Michael Skinner; Sven Albers; Harald Gossner; Peter Baumgartner; Hans-Joachim Barth

Archive | 2017

MICROELECTRONIC INTERCONNECT ADAPTOR

Christian Geissler; Klaus Reingruber; Sven Albers

Archive | 2017

COOLER FOR SEMICONDUCTOR DEVICES

Sven Albers; Klaus Reingruber; Andreas Wolter; Georg Seidemann; Christian Geissler; Alexandra Atzesdorfer; Sonja Koller

Archive | 2017

SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS

Klaus Reingruber; Sven Albers; Christian Geissler; Georg Seidemann; Bernd Waidhas; Thomas Wagner; Marc Dittes

Archive | 2017

ELECTRONIC PACKAGE WITH COIL FORMED ON CORE

Sven Albers; Klaus Reingruber; Andreas Wolter

Archive | 2017

Redistribution layer lines

Klaus Reingruber; Sven Albers; Christian Geissler

Archive | 2016

***WITHDRAWN PATENT AS PER THE LATEST USPTO WITHDRAWN LIST***Contact pads for integrated circuit packages

Sven Albers; Georg Seidemann; Sonja Koller; Stephan Stoeckl; Shubhada H. Sahasrabudhe; Sandeep B. Sane

Archive | 2016

CHIP PACKAGE-IN-PACKAGE

Thorsten Meyer; Sven Albers; Andreas Wolter

Archive | 2015

Embedded die flip-chip package assembly

Thorsten Meyer; Sven Albers

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Collaboration

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Georg Seidemann

Intel

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Andreas Wolter

Intel

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Christian Geissler

Intel

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Klaus Reingruber

Intel

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Thorsten Meyer

Intel

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Harald Gossner

Intel

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Michael Skinner

Intel

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Sonja Koller

Intel

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Peter Baumgartner

Intel

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Hans-Joachim Barth

Intel

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