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Archive | 2011

Carbon Nanotube Industrial Applications

Fang-Chang Tsai; C. M. Shu; Lung-Chang Tsai; Ning Ma; Yi Wen; Sheng Wen; Yingkui Yang; Wei Zhou; Hanwen Xiao; Yao-Chi Shu; Tao Jiang

Since carbon nanotube was discovered by S. Ijima in 1991, it has become one of the main academic research subjects. Carbon nanotube is the thinnest tube human can make presently. It has advantages in lightweight, high strength, high toughness, flexibility, high surface area, high thermal conductivity, good electric conductivity and chemical stability. Carbon nanotube can be applied to manufacture smaller transistors or electronic devices. Samsung Korea has made carbon nanotube into Field Emission Display. When the technology is matured and the cost is reduced, it will replace traditional bulky cathode ray tube (CRT) screen. Carbon nanotube has high toughness, so it can be made into highstrength composite with other materials. Thus, carbon nanotube is a material with high economic value and very worth researching. Besides, carbon nanotube has both conductor and semiconductor properties. Therefore, for electronic circuit, the semiconductor property of carbon nanotube enables its application to field emission transistor (FET) gate electrode, which has 100 times higher electric conductivity than silicon semiconductor when voltage is applied and 1000 times higher operational frequency than current Complementary MetalOxide Semiconductor (CMOS). The conductor property makes carbon nanotube have similar thermal conductivity to diamond and superior current carrying capacity to copper and gold. For the application of display, its long-term reliability is very excellent [Iijima, 1991, Lee et. al., 1977]. In order to create new material systems with superior properties, various nanoparticle morphologies have been used as reinforcing fillers in elastomeric matrices. These nanometerscale reinforcing particles include spherical particles such as silica or titania [McCarthy et. al., 1997, Kohjiya et. al., 2005], platelets such as layered silicates [Osman et. al., 2001, Joly et. al., 2002, Varghese & Karger-Kocsis, 2003, Kim et. al., 2004, Arroyo et. al., 2003, Bala et. al., 2004, Jeon et. al., 2004], carbon [Gauthier et. al., 2005] or clay fibers [Bokobza & Chauvin, 2005] and multiwall or singlewall carbon nanotubes[Barraza et.


Journal of Polymer Research | 2012

The compatible and mechanical properties of biodegradable poly(Lactic Acid)/ethylene glycidyl methacrylate copolymer blends

Jen-Taut Yeh; Chi-Hui Tsou; Ya-ming Li; Hanwen Xiao; Chin-San Wu; Wan-Lan Chai; Yu-Ching Lai; Chuen-Kai Wang

The Fourier transform infrared results suggest that the carboxylic acid groups of poly(lactic acid) (PLA) molecules react with the epoxy groups of molecules of Ethylene Glycidyl Methacrylate Copolymer (EGMC) during the reactive extrusion processes of PLAxEGMCy specimens. The tensile and tear strength values of PLAxEGMCy blown-film specimens in machine and transverse directions improve significantly, and reach their maximal values as their EGMC contents approach an optimum value of 6 wt.%. The melt shear viscosity values of PLAxEGMCy resins, measured at varying shear rates, are significantly higher than those of the PLA resin, and increase consistently with their EGMC contents. Differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) of PLA and PLAxEGMCy specimens reveal that the percentage crystallinity, peak melting temperature, and onset re-crystallization temperature values of PLAxEGMCy specimens reduce gradually as their EGMC contents increase. In contrast, the glass transition temperatures of PLAxEGMCy specimens increase gradually in conjunction with their EGMC contents. Demarcated porous morphology with several connected fungi-decomposed cavities was found on the surfaces of the PLAxEGMCy specimens after being buried for specific amounts of time, in which the sizes of the fungi-decomposed cavities found on the surfaces of buried PLAxEGMCy specimens reduce significantly as their EGMC contents increase. Further DMA and morphological analysis of PLAxEGMCy specimens reveal that the EGMC molecules are compatible with PLA molecules at EGMC contents equal to or less than 2 wt.% because no phase-separated EGMC droplets and tan δ transitions were found on fracture surfaces and tan δ curves of PLAxEGMCy specimens, respectively. The possible reasons for these remarkable properties of the PLA/EGMC specimens are proposed in this study.


Journal of Applied Polymer Science | 2009

Effect of plasticizer on the crystallization behavior of poly(lactic acid)

Hanwen Xiao; Wei Lu; Jen-Taut Yeh


Journal of Applied Polymer Science | 2010

Isothermal crystallization kinetics and crystal structure of poly(lactic acid): Effect of triphenyl phosphate and talc

Hanwen Xiao; Peng Li; Xiaomin Ren; Tao Jiang; Jen-Taut Yeh


Journal of Applied Polymer Science | 2009

Crystallization behavior of fully biodegradable poly(lactic acid)/poly(butylene adipate-co-terephthalate) blends

Hanwen Xiao; Wei Lu; Jen-Taut Yeh


Polymer Composites | 2010

Kinetics and crystal structure of poly(lactic acid) crystallized nonisothermally: Effect of plasticizer and nucleating agent

Hanwen Xiao; Li Yang; Xiaomin Ren; Tao Jiang; Jen-Taut Yeh


Journal of Applied Polymer Science | 2004

Morphology, rheology, and mechanical properties of dynamically cured EPDM/PP blend: Effect of curing agent dose variation

Hanwen Xiao; Shiqiang Huang; Tao Jiang


Journal of Applied Polymer Science | 2010

Kinetics and crystal structure of isothermal crystallization of poly(lactic acid) plasticized with triphenyl phosphate

Hanwen Xiao; Fen Liu; Tao Jiang; Jen-Taut Yeh


Journal of Applied Polymer Science | 2002

Miscibility of blends of ethylene‐propylene‐diene terpolymer and polypropylene

Hanwen Xiao; Shiqiang Huang; Tao Jiang; Shiyuan Cheng


Journal of Applied Polymer Science | 2007

Grafting of glycidyl methylacrylate onto chlorinated polypropylene and its bonding to aluminum flake

Hanwen Xiao; Fengyuan Yu; Ying Yu; Shiqiang Huang

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C. M. Shu

National Yunlin University of Science and Technology

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Lung-Chang Tsai

National Yunlin University of Science and Technology

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