Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Hasegawa Kiyoshi is active.

Publication


Featured researches published by Hasegawa Kiyoshi.


Archive | 2005

MANUFACTURING METHOD FOR PRINTED WIRING BOARD

Takai Kenji; Nakaso Akishi; Hasegawa Kiyoshi; Ito Toyoki; Urasaki Naoyuki; Ariga Shigeharu


Archive | 1988

ELECTROLESS COPPER PLATING METHOD

Yamanoi Kiyoshi; Hasegawa Kiyoshi; Nakaso Akishi; Nakajima Sumiko


Archive | 2012

CONDUCTIVE PARTICLE, INSULATING COATING CONDUCTIVE PARTICLE, METHOD OF MANUFACTURING THE SAME, AND ANISOTROPICALLY CONDUCTIVE ADHESIVE

Takai Kenji; Nagahara Yuko; Takahashi Akio; Hasegawa Kiyoshi; Uehara Toshishige


Archive | 2005

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Takai Kenji; Matsuura Masaharu; Moriike Michio; Hasegawa Kiyoshi; Nakaso Akishi


Archive | 2000

TERMINAL FOR SOLDER-BALL CONNECTION AND ITS FORMATION METHOD AND AS MANUFACTURE OF BOARD FOR SEMICONDUCTOR MOUNTING

Hasegawa Kiyoshi; Takahashi Akio


Archive | 1999

Substrate for mounting semiconductor and its production

Hasegawa Kiyoshi; Takahashi Akio; Nakaso Akishi


Archive | 2006

MULTILAYER PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND CHEMICAL ROUGHENING SOLUTION

Hiroyama Yukihisa; Sakayori Kazuhiko; Takita Takao; Hasegawa Kiyoshi


Archive | 2008

Connection terminal, semiconductor package using the same and method of fabricating for semiconductor package

Ejiri Yoshinori; Hatakeyama Shuichi; Arike Shigeharu; Hasegawa Kiyoshi


Archive | 1988

VERFAHREN ZUR HERSTELLUNG VON LEITERPLATTEN

Takahashi Hiroshi; Takanezawa Shin; Kanno Masao; Iwasaki Yorio; Okamura Toshirou; Nakaso Akishi; Hasegawa Kiyoshi


Archive | 2002

Connection terminal and semiconductor package using the same as well as manufacturing method thereof

Nodo Takaaki; Hasegawa Kiyoshi; Takahashi Akio

Collaboration


Dive into the Hasegawa Kiyoshi's collaboration.

Researchain Logo
Decentralizing Knowledge