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Dive into the research topics where Hauser Christian is active.

Publication


Featured researches published by Hauser Christian.


Archive | 2003

Electronic component comprises a semiconductor chip and a wiring plate connected to the active surface of the chip using a double-sided adhering film

Hauser Christian


Archive | 2002

Electronic component with semiconductor chip, has substrate attached via adhesive layer on to active chip surface

Hauser Christian


Archive | 2001

Surface-mount-device (SMD) type semiconductor device for LSI integrated circuits

Hauser Christian; Winderl Johann; Muench Thomas


Archive | 1999

Soldering integrated circuit or integrated circuit housing onto circuit board having conducting pathway uses lacquer or film mask with non-circular openings

Hauser Christian; Winderl Johann


Archive | 2003

Electronic component with one or more semiconductor chips, includes arrangement of through contacts forming edges of bond channel.

Hauser Christian; Winderl Johann; Haalboom Thomas; Reis Martin


Archive | 1999

Production of a ball grid array housing used for a chip comprises applying a copper foil with conducting pathways on a carrier and inserting reinforcements into the foil and/or into the carrier

Hauser Christian


Archive | 2002

Stacked electronic component device has perpendicular pins providing mechanical and electrical connections between stacked electronic components

Woerz Andreas; Winderl Johann; Hauser Christian


Archive | 2001

Gehäuseanordnung eines Halbleiterbausteins

Muff Simon; Pohl Jens; Wanninger Friedrich; Hauser Christian


Archive | 2000

Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren

Hauser Christian; Winderl Johann; Reis Martin


Archive | 2010

VERFAHREN ZUM VERBINDEN MINDESTENS EINES CHIPS MIT EINER UMVERDRAHTUNGSANORDNUNG

Hauser Christian; Reiss Martin; Winderl Johann

Collaboration


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Pohl Jens

Infineon Technologies

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Neu Achim

Infineon Technologies

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