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Winderl Johann

Infineon Technologies

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Publication

Featured researches published by Winderl Johann.

Archive | 2001

Surface-mount-device (SMD) type semiconductor device for LSI integrated circuits

Hauser Christian; Winderl Johann; Muench Thomas

Archive | 1999

Soldering integrated circuit or integrated circuit housing onto circuit board having conducting pathway uses lacquer or film mask with non-circular openings

Hauser Christian; Winderl Johann

Archive | 2003

Electronic component with one or more semiconductor chips, includes arrangement of through contacts forming edges of bond channel.

Hauser Christian; Winderl Johann; Haalboom Thomas; Reis Martin

Archive | 2002

Device used as a semiconductor chip comprises an electronic component, a mechanically and electrically connected wiring plate, and a flexible layer around the peripheral edges of the rear side of the electronic component

Winderl Johann; Neumayer Martin

Archive | 2002

Stacked electronic component device has perpendicular pins providing mechanical and electrical connections between stacked electronic components

Woerz Andreas; Winderl Johann; Hauser Christian

Archive | 2002

Arrangement used in electronic devices comprises an electronic component, a semiconductor chip, and a wiring plate on which the electronic component lies in the assembled state

Woerz Andreas; Winderl Johann

Archive | 2000

Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren

Hauser Christian; Winderl Johann; Reis Martin

Archive | 2010

VERFAHREN ZUM VERBINDEN MINDESTENS EINES CHIPS MIT EINER UMVERDRAHTUNGSANORDNUNG

Hauser Christian; Reiss Martin; Winderl Johann

Archive | 2001

Verfahren und Vorrichtung zum Verbinden mindestens eines Chips mit einer Umverdrahtungsanordnung

Winderl Johann; Hauser Christian; Reis Martin

Archive | 2001

Vorrichtung zum Verpacken von elektronischen Bauteilen

Hauser Christian; Pohl Jens; Winderl Johann

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Hauser Christian

Infineon Technologies

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Reis Martin

Infineon Technologies

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Woerz Andreas

Infineon Technologies

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Haalboom Thomas

Infineon Technologies

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Muench Thomas

Infineon Technologies

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Neumayer Martin

Infineon Technologies

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Pohl Jens

Infineon Technologies

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