Herbert Michel

8-channel optical demultiplexer realized as SiO/sub 2//Si flat-field spectrograph

The operation of a flat-field spectrograph in silica on silicon (SiO/sub 2//Si) for 2-nm channel spacing is demonstrated. Crosstalk attenuations of >20 dB and significantly reduced fiber-to-fiber insertion losses of 5 dB could be obtained.<<ETX>>

Development of a photonic integrated transceiver chip for WDM transmission

With the observed expansion of fiber-optic networks and the movement of line terminals towards the individual customer the need for cost-effective fabrication of customer access modules for interactive services arises. Monolithic integration of the module functions on InP is frequently seen as a means to reduce module costs. Here we describe a generic fabrication process for InP photonic integrated circuits and demonstrate an initial transceiver chip with transmit, receive and 1300/1530 nm wavelength division multiplexing functions. The chip output power reaches 1 mW at 1530 nm with a laser threshold current of 20 mA. The detection efficiency at 1300 nm is 0.1 A/W of fiber power.<<ETX>>

Wavelength-adaptable optical phased array in SiO/sub 2/-Si

An optical phased array in the silica-on-silicon material system (SiO/sub 2/-Si) with 8-nm channel spacing in the 1.5-/spl mu/m wavelength region is reported. The device exhibits quasi-polarization independent operation with insertion losses of 2.5-3 dB and crosstalk attenuations of >20 dB. It can be adapted to the specified center wavelength simultaneously with the adjustment of the input fiber.<<ETX>>

Photonic integrated transceiver for the access network

To reduce fabrication costs of fibre-optic terminal modules for interactive services, an InGaAsP/InP chip fabrication process has been developed for monolithic integration of a strained-layer multiple quantum well laser, a monitor diode and a photoreceiver with a 1300/1530nm filter. Reception responsivity and output power of the chips are 0.1 AW-1 at 1300nm wavelength and 4.5mW at 1530nm wavelength, respectively. At present, complete modules with fibre pigtail exhibit 0.7mW launch power, but 1.4 mW is expected with the latest chips.