Hidetaka Shigi

High wiring density Cu-polyimide thin film multilayer circuit which is realized by the vertical plated small via

A fabrication process for Cu-polyimide thin film multilayer circuit has been developed for advanced multichip module. The multilayer circuit realizes a high wiring density circuit by applying Cu studs which are deposited by electroplating using the guide patterns made of thick positive photoresist, photosensitive polyimide for insulating layers which has low reactivity against Cu, and a polishing process for planarizing dielectric layers. This paper reports on the structure of the circuit and on the thin film process technology.

Stress Analysis On Hybrid Multilayer Substrate Composed Of Polyimide And Ceramics

The mechanical characteristics of thin film multilayer circuits ire investigated by stress analysis based on experiments. The warping and separation of the film from the substrate is observed experimentally by repeatedly depositing polyimide films on the substrate, revealing the relationship between film thickness and stress in the film. To simulate the stress, we estimated the mechanical properties from the warpings of the films on the substrates. substrate is a quadratic function of the film thickness deposited on it, just as for a bi-metal. The maximum thickness of thin film that will not peel off from the substrate can be estimated from this relationship. The warping of the