Hiroaki Takeishi

Nanoimprint System Development and Status for High Volume Semiconductor Manufacturing

Imprint lithography has been shown to be an effective technique for replication of nano-scale features. Jet and Flash Imprint Lithography (J-FIL) involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate. The patterned mask is lowered into the fluid which then quickly flows into the relief patterns in the mask by capillary action. Following this filling step, the resist is cross-linked under UV radiation, and then the mask is removed, leaving a patterned resist on the substrate. Criteria specific to any lithographic process for the semiconductor industry include overlay, throughput and defectivity. The purpose of this paper is to describe the technology advancements made and introduce the new imprint systems that will be applied for the fabrication of advanced devices such as NAND Flash memory and DRAM. Overlay of better than 5nm (mean + 3sigma) has been demonstrated, and throughputs of 10 wafers per imprint station are now routinely achieved. Defectivity has been reduced by more than two orders of magnitude and particle adders within the tool have come down by approximately four orders of magnitude. A pilot line tool, the FPA-1100 NZ2, was used to generate most of the results in this work and conceptual plans are in place to address the requirements necessary for high volume manufacturing with an attractive cost of ownership relative to other HVM solutions for the semiconductor industry.

Imaging performance of scanning exposure systems

Relative position between the projected image on the wafer and the wafer itself changes during exposure. Factors of change are, for example, stage control error, difference of scanning direction between wafer stage and reticle stage (skew) and distortion of projection optics. We can define a kind of probability density function (PDF) concerning these changes of relative position. Fourier transform of this PDF is the transfer function of image transformation by relative motion. In this paper, we call this transfer function MoTF. The modulation of MoTF becomes a barometer of image contrast and the phase of MoTF gives position deviation (distortion). By analytical study of MoTF, standard deviation and expected value of said PDF are found to be the key parameters. Derived approximate equation in this paper agree with a computer simulation result of image contrast deterioration by vibration. With these studies, we can establish adequate specifications of scanning stage control demanded by imaging performance. Canon has developed a new stage structure for scanning exposures. By this structure the wafer stage is separated from main body on which projection optics and measurement systems are mounted so that reaction forces of stage acceleration can not be transferred directly to the maim body. With this structure we achieved excellent stage performance which has achieved imaging performance below 0.18 micrometer with high speed scanning.