Hirohiko Nemoto

Fabrication of a miniature thermoelectric module with elements composed of sintered Bi-Te compounds

A new manufacturing process of a /spl pi/-shaped miniature thermoelectric module composed of sintered Bi-Te compounds has been developed. The manufacturing process is suitable for mass production as it is comprised of simple technologies such as conventional photolithography technology, microbonding technology using the solder bump method and precise cutting technology using a dicing machine. A miniature module with the dimensions of 3 mm/spl times/3 mm/spl times/1.3 mm in which 102 elements (51 junctions) with the dimensions of 120 /spl mu/m/spl times/120 /spl mu/m in cross section parallel to the substrates and a height of 600 /spl mu/m were included was fabricated while developing the process. The maximum temperature difference /spl Delta/T/sub max/, and the heat absorption Q/sub max/ of the module were 61.3/spl deg/C and 0.36 W, respectively. This indicates that the performance of the module as a cooling device was equivalent to that of conventional modules. The specification for high voltage and low current input, a significant purpose in addition to the miniaturization of the module, was achieved because the maximum voltage V/sub max/ and current I/sub max/ were 6.7 V and 110 mA, respectively.