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Hironobu Kawasato

NEC

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Publication

Featured researches published by Hironobu Kawasato.

Archive | 2002

Epoxy resin composition, varnish, film adhesive made by using epoxy resin composition, and its cured material

Hironobu Kawasato; Tokuo Yamashita; Hiroyuki Yano; 徳夫 山下; 浩信 川里; 博之 矢野

Archive | 2007

Laminate for wiring board

Yasuhiro Adachi; Hironori Nagaoka; Hongyuan Wang; Naoko Osawa; Masahiko Takeuchi; Hironobu Kawasato

Archive | 2001

Photo- or heat-curable resin composition and multilayer printed wiring board

Masahiko Takeuchi; Kazuhiko Mizuuchi; Hironobu Kawasato

Archive | 2002

Laminated body for wiring board

Katsufumi Hiraishi; Hironobu Kawasato; Koen O; 浩信 川里; 克文 平石; 宏遠 王

Archive | 2004

PHOTOSENSITIVE RESIN COMPOSITION AND CURED OBJECT

Hironobu Kawasato; Yasutake Murata; Kenryo Sasaki; 健了 佐々木; 浩信 川里; 泰毅 村田

Archive | 2000

Photo- or thermo-setting resin composition and printed wiring board

Hironobu Kawasato; Kazuhiko Mizuuchi; Masahiko Takeuchi; 浩信 川里; 和彦 水内; 正彦 竹内

Archive | 1998

Aromatic ester (meth)acrylate dendrimer and curable resin composition

Masatoshi Yuasa; Hironobu Kawasato; Takero Teramoto

Archive | 2002

Photosensitive resin composition excellent in adhesion and its cured body

Hironobu Kawasato; Koji Nakamura; Masahiko Takeuchi; 幸二 中村; 浩信 川里; 正彦 竹内

Archive | 2000

PHOTOSETTING OR THERMOSETTING RESIN COMPONENT, AND MULTILAYER PRINTED WIRING BOARD

Hironobu Kawasato; Kazuhiko Mizuuchi; Masahiko Takeuchi; 浩信 川里; 和彦 水内; 正彦 竹内

Archive | 2005

Aromatic polyamic acid, polyimide and lamination body for wiring board

Noriko Chikaraishi; Hironobu Kawasato; Koen O; 典子 力石; 浩信 川里; 宏遠 王

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Collaboration

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Masahiko Takeuchi

Mitsubishi

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Takero Teramoto

NEC

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Hiroaki Yamada

Kyushu University

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Hiroyuki Yano

Toshiba

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Hongyuan Wang

Yamaguchi University

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Koji Matsui

NEC

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Shinji Inaba

Unitika Ltd.

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Tadanori Shimoto

NEC

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裕章 山田

Kyushu University

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