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Hiroshi Odaira

Toshiba

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Publication

Featured researches published by Hiroshi Odaira.

Archive | 1994

Circuit devices and fabrication Method of the same

Hiroshi Odaira; Eiji Imamura; Yusuke Wada; Yasushi Arai; Kenji Sasaoka; Takahiro Mori; Fumitoshi Ikegaya; Sadao C O Intellectua Kowatari

Archive | 1996

Multilayer wiring board and method for forming the same

Kenji Sasaoka; Hiroshi Odaira; Madoka Fujiwara; Fumitoshi Ikegaya; Takahiro Mori

Archive | 1995

A New Circuit Substrate for MCM-L

Yusuke Wada; Kenji Sasaoka; Eiji Imamura; Hiroshi Odaira

Archive | 1994

Wiring boards and manufacturing methods thereof

Atsuko Iida; Hiroshi Odaira; Yoshizumi Sato; Yuichi Yamamoto

Archive | 1996

Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar

Kenji Sasaoka; Hiroshi Odaira; Madoka Fujiwara; Fumitoshi Ikegaya; Takahiro Mori

Archive | 1998

Contact converting structure of semiconductor chip and process for manufacturing semiconductor chip having said contact converting structure

Etsuji Suzuki; Hiroshi Odaira; Eiji Imamura

Archive | 1992

Method of producing a three-dimensional wiring board

Hiroshi Odaira; Yoshizumi Sato

Journal of Japan Institute of Electronics Packaging | 1996

Development of High Density PWB by a New Layer Interconnection Method

Hiroshi Odaira; Kenji Sasaoka; Eiji Imamura; Kazuyasu Tanaka

Archive | 1996

Mehrschichtige leiterplatte, vorgefertigtes material für diese leiterplatte, verfahren zur herstellung einer mehrschichtigen leiterplatte, packung elektronischer bauelemente und verfahren zur herstellung vertikaler, elektrisch leitender verbindungen Multilayer PCB, ready-made material for this circuit board, process for manufacturing a multilayer circuit board, electronic packaging devices and methods for manufacturing vertical electrically conductive connections

Madoka Fujiwara; Fumitoshi Ebina-shi Ikegaya; Takahiro Kawasaki-shi Mori; Hiroshi Odaira; Kenji Zama-shi Sasaoka

Archive | 1996

Mehrschichtige leiterplatte, vorgefertigtes material für diese leiterplatte, verfahren zur herstellung einer mehrschichtigen leiterplatte, packung elektronischer bauelemente und verfahren zur herstellung vertikaler, elektrisch leitender verbindungen

Kenji Sasaoka; Hiroshi Odaira; Madoka Fujiwara; Fumitoshi Ikegaya; Takahiro Mori

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Collaboration

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Kenji Sasaoka

Toshiba

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Eiji Imamura

Toshiba

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Fumitoshi Ikegaya

Toshiba

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Madoka Fujiwara

Toshiba

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Takahiro Mori

Toshiba

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Yoshizumi Sato

Toshiba

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Yusuke Wada

Toshiba

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Atsuko Iida

Toshiba

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Kazuyasu Tanaka

Toshiba

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Sadao C O Intellectua Kowatari

Toshiba

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