Hiroyuki Kitabayashi

Improvements of external quantum efficiency of InGaN-based blue light-emitting diodes at high current density using GaN substrates

InGaN-based blue light-emitting diodes (LEDs) with different quantum well (QW) thicknesses were grown on freestanding GaN substrates with low threading dislocation densities (TDDs) and on c-plane sapphire substrates. In the case of thin QWs of 3nm in thickness, the external quantum efficiencies (EQEs) of LEDs on GaN substrates, as well as those on sapphire substrates, decreased with increasing forward current, indicating that carrier localization is in play on both types of substrates. For thicker 5-nm-thick QWs, the EQEs of LEDs grown on GaN substrates improved at high current densities, while those on sapphire substrates decreased even at low current densities. The LED with 5-nm-thick QWs on the GaN substrate mounted p-side down and molded with epoxy showed EQE as high as 26% at 125A∕cm2. Cathodoluminescence observations of the active layers on GaN substrates revealed that the expansion of nonradiative areas related to TDDs, which are responsible for the deterioration of the EQE of the LED on the sapphi...

Diamond-based surface acoustic wave devices

Research and development have been carried out to apply the CVD diamond film to surface acoustic wave (SAW) devices. Several kinds of layered structures including a diamond layer have been investigated by the calculations and experiments, and it has been found that the diamond SAW has great advantages for the application of high-frequency SAW devices with high SAW velocity, small temperature coefficient and high power durability. Practical SAW devices have been successfully fabricated with ZnO/diamond/Si and SiO2/ZnO/diamond/Si structures whose characteristics are superior to those with conventional SAW materials.

Ti/Al/Si Ohmic Contacts for both n-Type and p-Type 4H-SiC

An ohmic contact process by using tri-layer materials for a source contact of a silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) is proposed. The authors validate its extremely low contact resistance for both n-type and p-type SiC by a simple process. The characteristics of Ti/Al/Si ohmic contacts were measured by using the transfer length method (TLM). We examined the dependence of the contact resistance on the thickness of each layer of Ti/Al/Si. Then, it is found that Ti/Al/Si contacts with an appropriate thickness show excellent ohmic properties for both n-type and p-type SiC. N-type specific contact resistance (ρn) of 3.7 × 10-6 Ω cm2 and p-type specific contact resistance (ρp) of 1.7 × 10-4 Ω cm2 are obtained with Ti (20 nm) /Al (30 nm) /Si (30 nm).