Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Hiroyuki Tenmei is active.

Publication


Featured researches published by Hiroyuki Tenmei.


Archive | 2001

Semiconductor module and method of making the device

Yoshihide Yamaguchi; Takao Terabayashi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda


Archive | 2002

Method of fabricating a wafer level chip size package utilizing a maskless exposure

Yoshihide Yamaguchi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda


Archive | 2001

Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices

Yoshihide Yamaguchi; Takao Terabayashi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda


Archive | 2001

Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure

Yoshihide Yamaguchi; Hiroyuki Tenmei; Kosuke Inoue; Noriyuki Oroku; Hiroshi Hozoji; Shigeharu Tsunoda; Naoya Kanda; Madoka Minagawa; Ichiro Anjo; Asao Nishimura; Kenji Ujiie; Akira Yajima


Archive | 2000

Wiring board and its production method, semiconductor device and its production method, and electronic apparatus

Yasumori Narizuka; Mitsuko Itou; Yoshihide Yamaguchi; Hiroyuki Tenmei


Archive | 2002

Semiconductor device and structure for mounting the same

Yoshihide Yamaguchi; Shigeharu Tsunoda; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda


Archive | 2010

Semiconductor device having a liquid cooling module

Nae Hisano; Shigeo Ohashi; Yasuo Osone; Yasuhiro Naka; Hiroyuki Tenmei; Kunihiko Nishi; Hiroaki Ikeda; Masakazu Ishino; Hideharu Miyake; Shiro Uchiyama


Archive | 2004

Wiring board and method for producing same

Yasunori Narizuka; Mitsuko Itou; Yoshihide Yamaguchi; Hiroyuki Tenmei


Journal of Japan Institute of Electronics Packaging | 1998

Development of Multilayer Wiring Board by Simultaneous Stacking Method of Tape Film

Masakazu Ishino; Hiroyuki Tenmei; Shuji Eguchi; Mamoru Mita


Archive | 2007

METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND A WAFER USED THEREIN

Hiroaki Ikeda; Masakazu Ishino; Hiroyuki Tenmei; Naoya Kanda; Yasuhiro Naka; Kunihiko Nishi

Collaboration


Dive into the Hiroyuki Tenmei's collaboration.

Researchain Logo
Decentralizing Knowledge