Hisashi Kawafuji

Ultra-small compact transfer molded package for power modules

DIP-IPMs are intelligent power modules that integrate power devices, drivers and protection circuits in a dual-in-line transfer-molded package. The new generation DIP-IPM package applies an isolated thermal sheet and a unique molding process. The thermal sheet is composed of a ceramic filler with high thermal conductivity and a thermosetting resin. This sheet is attached to the lead frame so as to not form any clearance, and the other side is exposed on the surface of the package. This technique contributes to the reduction of the thermal resistance to one third that of a conventional one, and a space savings of approximately 40% for the package.

Large Package Transfer Molded DIP-IPM

This paper presents a new larger version of the dual in-line package transfer molded Intelligent Power Module (DIP-IPM) developed by Mitsubishi Electric for home appliance motor control. The new large DIP-IPM utilizes a high thermal conductivity insulating resin sheet and an integrated aluminum heat spreader to provide the reduced thermal impedance and mechanical integrity required for a higher power applications. Using this approach the range DIP-IPM ratings has now been extended to 75 A at 600 V and 35 A at 1200 V. Like the lower power DIP-IPMs the new large DIP has high voltage integrated circuit (HVIC) based level shifting gate drive with short circuit protection and under voltage lock-out. However, in order to avoid the need for an excessively large current sensing resistor the new DIP uses IGBT chips with a current mirror emitter that produces a low level current proportional to the main emitter current for short circuit detection. In addition, the new DIP-IPM also provides an analog feedback signal proportional the modules temperature.

Latest Progress in Power Modules for Appliance Inverter Applications

This paper presents a new version of the dual in-line package intelligent power module (DIP-IPM Ver.4) developed by Mitsubishi Electric for home appliance motor control. The DIP-IPM Ver.4, features a completely lead free process with both chip bonding solders and lead plating compliant with international initiatives for the reduction of hazardous materials. Package miniaturization has been achieved by utilizing a new insulating resin sheet with high thermal conductivity, direct wire bonding technology, and an optimized lead frame design