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Hoe-Ku Jung

Samsung Electro-Mechanics

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Publication

Featured researches published by Hoe-Ku Jung.

Archive | 2007

Bottom substrate of package on package and manufacturing method thereof

Jung-Hyun Park; Byoung-Youl Min; Je-Gwang Yoo; Myung-Sam Kang; Hoe-Ku Jung; Ji-Eun Kim

Archive | 2006

Rigid-flexible printed circuit board for package on package and manufacturing method

Hoe-Ku Jung; Myung-Sam Kang; Jung-Hyun Park

Archive | 2009

Board on chip package and manufacturing method thereof

Myung-Sam Kang; Chang-Sup Ryu; Jung-Hyun Park; Hoe-Ku Jung; Ji-Eun Kim

Archive | 2007

Circuit board and method for manufaturing thereof

Shuhichi Okabe; Myung-Sam Kang; Jung-Hyun Park; Hoe-Ku Jung; Jeong-Woo Park; Ji-Eun Kim

Archive | 2008

Method for forming transcriptional circuit and method for manufacturing circuit board

Sang-Duck Kim; Jung-Hyun Park; Hoe-Ku Jung; Jong-Gyu Choi; Ji-Eun Kim; Jeong-Woo Park

Archive | 2011

Board on chip package

Myung-Sam Kang; Chang-Sup Ryu; Jung-Hyun Park; Hoe-Ku Jung; Ji-Eun Kim

Archive | 2011

Circuit board with buried circuit pattern

Hoe-Ku Jung; Je-Gwang Yoo; Myung-Sam Kang; Ji-Eun Kim; Jeong-Woo Park; Jung-Hyun Park

Archive | 2007

Manufacturing method of a package substrate

Myung-Sam Kang; Je-Gwang Yoo; Jung-Hyun Park; Ji-Eun Kim; Hoe-Ku Jung; Jin-Yong An

Archive | 2010

Manufacturing method of bottom substrate of package

Jung-Hyun Park; Byoung-Youl Min; Je-Gwang Yoo; Myung-Sam Kang; Hoe-Ku Jung; Ji-Eun Kim

Archive | 2009

Buried pattern substrate

Shuhichi Okabe; Myung-Sam Kang; Jung-Hyun Park; Hoe-Ku Jung; Ji-Eun Kim

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Collaboration

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Jung-Hyun Park

Samsung Electro-Mechanics

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Myung-Sam Kang

Samsung Electro-Mechanics

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Ji-Eun Kim

Keimyung University

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Jeong-Woo Park

Samsung Electro-Mechanics

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Shuhichi Okabe

Samsung Electro-Mechanics

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Je-Gwang Yoo

Samsung Electro-Mechanics

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Byoung-Youl Min

Samsung Electro-Mechanics

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Chang-Sup Ryu

Samsung Electro-Mechanics

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Jin-Yong An

Samsung Electro-Mechanics

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Jong-Gyu Choi

Samsung Electro-Mechanics

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