Holger Möller

Producing hard mask for semiconductor structure involves providing structured mask layer on hard mask layer, ion implantation, removing structured layer, structuring hard mask layer by selectively etching non-implanted or implanted region

Lithography mask and lithography system for direction-dependent exposure

Verfahren zum Belichten eines fotoempfindlichen Lackes auf einem Halbleiterwafer

Forming a pattern on a semiconductor substrate layer comprises applying a photosensitive resist to the substrate, exposing the resist and heating

Verfahren zur Bildung eines Musters in einer Schicht auf einem Halbleitersubstrat

Lithography mask and lithography system for directional exposure

Lithography system for directional exposure

Method for exposing photosensitive lacquer on semiconductor wafer to form structure pattern in lacquer in manufacture of integrated circuits, forming layer on wafer

Lithography mask comprises a structure for transferring a layout onto a substrate, with a blind macrostructure to suppress scattered light

Lithographiemaske und Lithographiesystem für richtungsabhängige Belichtung