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Hu Hsien-Pin

TSMC

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Publication

Featured researches published by Hu Hsien-Pin.

Archive | 2017

Struktur und Bildungsverfahren für Chippaket

Wei Wen-Hsin; Wu Chi-Hsi; Yu Chen-Hua; Hu Hsien-Pin; Chen Wei-Ming; Hou Shang-Yun

Archive | 2017

Stacked integrated circuit structure

Chen Wei-Ming; Hu Hsien-Pin; Hou Shang-Yun; Wei Wen-Hsin

Archive | 2017

Herstellung von großen Chips durch Stitching

Wei Wen Hsin; Hu Hsien-Pin; Hou Shang-Yun; Chen Wei-Ming

Archive | 2017

Stacked Integrated Circuit Structure and Method of Forming

Chen Wei-Ming; Hu Hsien-Pin; Hou Shang-Yun; Wei Wen Hsin

Archive | 2016

Chip Package Having Die Structures of Different Heights and Method of Forming Same

Wei Wen-Hsin; Wu Chi-Hsi; Yu Chen-Hua; Hu Hsien-Pin; Hou Shang-Yun; Chen Wei-Ming

Archive | 2016

Kondensator mit Sicherungsschutz

Lin Liang-Chen; Yeh Tung-Chin; Lin Shih-Kai; Lu Gia-Her; Wu Jyun-Lin; Hu Hsien-Pin; Chang Shih-Cheng; Hou Fu-Tsai

Archive | 2015

Interposer test structures

Liu Tzuan-Horng; Yu Chen-Hua; Hu Hsien-Pin; Wang Tzu-Yu; Wu Wei-Cheng; Hou Shang-Yun; Jeng Shin-Puu

Archive | 2015

Silicon interposer structure, package structure and method of forming silicon interposer structure

Liu Tzuan-Horng; Huang Shih-Wen; Lu Chung-Yu; Hu Hsien-Pin; Hou Shang-Yun; Jeng Shin-Puu

Archive | 2015

Circuit with fuse protection and circuit protection method

Chang Shih-Cheng; Lin Liang-Chen; Hou Fu-Tsai; Yeh Tung-Chin; Lin Shih-Kai; Lu Gia-Her; Wu Jyun-Lin; Hu Hsien-Pin

Archive | 2013

Integrated circuit device and its forming method

Hu Hsien-Pin; Yu Chen-Hua; Chen Ming-Fa; Lin Jing-Cheng; Lai Jiun Ren; Lin Yung-Chi

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Hou Shang-Yun

TSMC

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Chen Wei-Ming

TSMC

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Yu Chen-Hua

TSMC

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Jeng Shin-Puu

TSMC

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Wei Wen-Hsin

TSMC

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Chang Shih-Cheng

TSMC

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Hou Fu-Tsai

TSMC

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Lin Liang-Chen

TSMC

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Lin Shih-Kai

TSMC

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Lu Gia-Her

TSMC

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