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Jeng Shin-Puu

TSMC

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Publication

Featured researches published by Jeng Shin-Puu.

Archive | 2010

Dies, stacked structures, and systems

Chen Hsien-Wei; Jeng Shin-Puu; Tu Hung-Jung; Chiou Wen-Chih

Archive | 2013

Protection sealing ring used for preventing stress caused by cutting die

Jeng Shin-Puu; Chen Hsien-Wei; Hou Shang-Yun; Tsai Hao-Yi; Wu Anbiarshy N F; Liu Yu-Wen

Archive | 2011

Semiconductor devices, packaging assemblies, and method for manufacturing semiconductor devices

Hsiao Yi-Li; Yu Chen-Hua; Jeng Shin-Puu; Tung Chih-Hang; Wei Cheng-Chang

Archive | 2010

DIE, STACK STRUCTURE AND SYSTEM

Chen Hsien-Wei; Jeng Shin-Puu; Tu Hung-Jung; Chiou Wen-Chih

Archive | 2017

CHIP PACKAGE AND FORMATION METHOD THEREOF

Hung Jui-Pin; Huang Cheng-Lin; Liu Hsien-Wen; Jeng Shin-Puu

Archive | 2012

Interposer structure and semiconductor package structure

Liu Tzuan-Horng; Yu Chen-Hua; Hu Shien-Pin; Wang Tzu-Yu; Wu Wei-Cheng; Hou Shang-Yun; Jeng Shin-Puu

Archive | 2012

A semiconductor structure and a forming method for a semiconductor device

Wang Tzu-Yu; Hsieh Chi-Chun; Su An-Jhih; Chen Hsien-Wei; Jeng Shin-Puu; Lin Liwei

Archive | 2007

A metal fuse for semiconductor devices and methods of manufacturing thereof

Jeng Shin-Puu

Archive | 2013

Structure with alignment mark and manufacture method for stacking device

Tsai Chen-Yu; Wang Shih-Hui; Chiu Chien-Ming; Chen Chia-Ho; Tsai Fang-Wen; Wu Weng-Jin; Lin Jing-Cheng; Chiou Wen-Chih; Jeng Shin-Puu; Yu Chen-Hua

Archive | 2012

Device and method for forming the same

Wu Weng-Jin; Shih Ying-Ching; Chiou Wen-Chih; Jeng Shin-Puu; Yu Chen-Hua

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Collaboration

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Yu Chen-Hua

TSMC

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Hou Shang-Yun

TSMC

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Chen Hsien-Wei

TSMC

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Chiou Wen-Chih

TSMC

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Lin Jing-Cheng

TSMC

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Wu Wei-Cheng

TSMC

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Hung Jui-Pin

TSMC

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Yeh Der-Chyang

TSMC

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Hu Hsien-Pin

TSMC

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Huang Cheng-Lin

TSMC

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