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Dive into the research topics where Hubert Maier is active.

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Featured researches published by Hubert Maier.


international symposium on power semiconductor devices and ic's | 2009

Fabrication of trench isolation and trench power MOSFETs in a smart power IC Technology with a single trench unit process

Christoph Kadow; Stefan Decker; Donald Dibra; Norbert Krischke; Sven Lanzerstorfer; Hubert Maier; Thorsten Meyer; Nicola Vannucci; Robert Zink

We report on using a single trench unit process for the trench isolation and for the trench power MOSFET of a common-drain smart power IC technology. The trench power MOSFET has a maximum specific on-resistance, (Ron⋅A), below 50mΩ-mm2 and a typical breakdown voltage, Vbr, of 95V. The trench isolation provides well isolation up to 90V. Using a single trench unit process for both devices results in low process costs. In addition both power and logic areas of a chip benefit from the trench process.


Archive | 2007

Method of forming a semiconductor structure comprising insulating layers with different thicknesses

Nicola Vannucci; Hubert Maier


Archive | 2001

Method for producing an electrode of a field-effect-controllable semiconductor component and field-effect-controllable semiconductor component

Sven Lanzerstorfer; Hubert Maier


Archive | 2005

Method for forming an integrated semiconductor circuit arrangement

Johann Rieger; Stefan Dr. Lipp; Hans Zeindl; Thomas Detzel; Hubert Maier


Archive | 2000

Production of an electrode of a semiconductor element used in the production of power transistors, especially power FETs comprises preparing a semiconductor body (10) having a first zone

Sven Lanzerstorfer; Hubert Maier


Archive | 2015

Passivation Layer and Method of Making a Passivation Layer

Kurt Matoy; Hubert Maier; Christian Krenn; Elfriede Wellenzohn; Helmut Schoenherr; Juergen Steinbrenner; Markus Kahn; Silvana Fister; Christoph Brunner; Herbert Gietler; Uwe Hoeckele


Archive | 2006

Semiconductor device for bonding connection

Hubert Maier; Thomas Detzel


Archive | 2015

Separation of Chips on a Substrate

Manfred Engelhardt; Gudrun Stranzl; Markus Zundel; Hubert Maier


Archive | 2015

METHOD FOR PROCESSING WAFER

Hubert Maier


Archive | 2007

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT

Thomas Detzel; Hubert Maier; Kai-Alexander Schreiber; Stefan Woehlert; Uwe Hoeckele

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