Hunt Hang Jiang

Multilayer high density flex technology

The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densities needed to meet these demands in a wide range of packaging and interconnection technologies. This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 /spl mu/m to 40 /spl mu/m are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential.

Adhesion evaluation of adhesiveless metal/polyimide substrate for MCM and high density packaging

Directly metallized polyimide films are being widely used as advanced high-density packaging substrates. Adhesion of metal to polyimide is a key performance requirement of the film. Excellent initial adhesion and good retention after severe process steps and reliability stresses are required. In this paper, the adhesion performances of films with different types of polyimide and tie layer from multiple vendors have been evaluated. The interface failure mechanisms are also examined via SEM micrographs and XPS survey scans. Peel strength and its retention behaviour are characterized in term of tie layer materials, environmental stresses and surface analysis results. The object of this work is to select the proper base material for high-density flexible multilayer substrates, a technology which is under development by FCPT.