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Featured researches published by Solomon I. Beilin.


electronic components and technology conference | 1999

Multilayer high density flex technology

Bill Chou; Solomon I. Beilin; Hunt Hang Jiang; D. Kudzuma; Michael Lee; Mark Thomas McCormack; Thomas J. Massingill; Michael G. Peters; James Roman; Yasuhito Takahashi; V. Wang

The industrial trend of shrinking microelectronic devices while increasing the density of interconnections places great demands on the substrates upon which these devices are packaged. Multilayer flex circuits will provide the interconnection densities needed to meet these demands in a wide range of packaging and interconnection technologies. This paper discusses the development of ultra-high density flexible circuits. Processes and materials to fabricate fine line pitches from 12.5 /spl mu/m to 40 /spl mu/m are examined. Various microvia structures, through hole and blind via, are demonstrated. A test vehicle was designed and built for BGA packages to illustrate the density capability. A four-layer structure is demonstrated by using Z-connection to connect two layer pairs. Electrical, mechanical, and reliability test results are presented to show the selection of flex substrate material, Z-connection methodology and fabrication processes. A cost comparison of high-density flex to alternative substrates is discussed to identify potential.


Archive | 1992

Wire interconnect structures for connecting an integrated circuit to a substrate

David G. Love; Larry L. Moresco; William T. Chou; David A. Horine; Connie Mak Wong; Solomon I. Beilin


Archive | 1999

Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Masaaki Inao; Michael G. Lee; William T. Chou; Solomon I. Beilin; Wen-chou Vincent Wang; James Roman; Thomas J. Massingill


Archive | 1993

Through hole interconnect substrate fabrication process

Solomon I. Beilin; Michael G. Peters; Michael G. Lee; Wen-chou V. Wang


Archive | 2001

Single and multilayer waveguides and fabrication process

Tetsuzo Yoshimura; Yasuhito Takahashi; James Roman; Solomon I. Beilin; Wen-chou Vincent Wang; Masaaki Inao


Archive | 2001

Optical coupling structures and the fabrication processes

Tetsuzo Yoshimura; Yasuhito Takahashi; James Roman; Mark Thomas McCormack; Solomon I. Beilin; Wen-chou Vincent Wang; Masaaki Inao


Archive | 2001

Optical reflective structures and method for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Kiyoshi Kuwabara; Solomon I. Beilin; Michael G. Peters; Wen-chou Vincent Wang; Masaaki Inao


Archive | 1998

Chip and board stress relief interposer

Michael Guang-Tzong Lee; Solomon I. Beilin; Wen-chou Vincent Wang


Archive | 1995

Controlled impedence interposer substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase


Archive | 2000

Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like

Wen-chou Vincent Wang; Michael G. Lee; Solomon I. Beilin

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