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Hyeog Chan Kwon

STATS ChipPAC Ltd

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Publication

Featured researches published by Hyeog Chan Kwon.

Archive | 2006

Integrated circuit package-in-package system

Choong Bin Yim; Hyeog Chan Kwon; Jong-Woo Ha

Archive | 2006

Integrated circuit package system

Choong Bin Yim; Hyeog Chan Kwon; Jong-Woo Ha

Archive | 2010

Integrated circuit package system including honeycomb molding

Hyeog Chan Kwon; Hyun Joung Kim; Jae Chang Kim; Taeg Ki Lim; Jong Wook Ju

Archive | 2006

Stacked semiconductor package having adhesive/spacer structure and insulation

Hyeog Chan Kwon; Marcos Karnezos

Archive | 2004

Die to substrate attach using printed adhesive

Hyeog Chan Kwon; Sang-Ho Lee; Jong Wook Ju

Archive | 2008

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE

Soo-San Park; Hyeog Chan Kwon; Sang-Ho Lee; Jong-Woo Ha

Archive | 2005

Stacked integrated circuit and package system

Tae Sung Jeong; Hyeog Chan Kwon; Youngcheol Kim

Archive | 2006

WAFER SCALE HEAT SLUG SYSTEM

Hyeog Chan Kwon

Archive | 2006

Adhesive/spacer island structure for multiple die package

Sang-Ho Lee; Jong Wook Ju; Hyeog Chan Kwon

Archive | 2004

Semiconductor chip packaging method with individually placed film adhesive pieces

Jin-Wook Jeong; In-Sang Yoon; Hee Bong Lee; Hyun-Joon Oh; Hyeog Chan Kwon; Jong Wook Ju; Sang-Ho Lee

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Collaboration

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Jong Wook Ju

STATS ChipPAC Ltd

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Sang-Ho Lee

STATS ChipPAC Ltd

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Jong-Woo Ha

STATS ChipPAC Ltd

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Choong Bin Yim

STATS ChipPAC Ltd

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Hee Bong Lee

STATS ChipPAC Ltd

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Tae Sung Jeong

STATS ChipPAC Ltd

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Youngcheol Kim

STATS ChipPAC Ltd

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Hyun Joung Kim

STATS ChipPAC Ltd

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Jae Chang Kim

STATS ChipPAC Ltd

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Soo-San Park

STATS ChipPAC Ltd

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