Jong-Woo Ha

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND METHOD OF MANUFACTURE THEREOF

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN OFFSET STACKED CONFIGURATION

Integrated circuit package system with flip chip

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE

Integrated circuit package stacking system with redistribution and method of manufacture thereof

Integrated circuit package system with stacking module

Integrated circuit package system employing bump technology

Integrated circuit package-in-package system with side-by-side and offset stacking

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF

Integrated circuit package system with symmetric packaging