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Jong-Woo Ha

STATS ChipPAC Ltd

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Publication

Featured researches published by Jong-Woo Ha.

Archive | 2009

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND METHOD OF MANUFACTURE THEREOF

Jong-Woo Ha; Daesik Choi; Byoung Wook Jang

Archive | 2008

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING AN OFFSET STACKED CONFIGURATION

Daesik Choi; BumJoon Hong; Sang-Ho Lee; Jong-Woo Ha; Soo-San Park

Archive | 2007

Integrated circuit package system with flip chip

Soo-San Park; BumJoon Hong; Sang-Ho Lee; Jong-Woo Ha; Daesik Choi

Archive | 2008

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE

Soo-San Park; Hyeog Chan Kwon; Sang-Ho Lee; Jong-Woo Ha

Archive | 2009

Integrated circuit package stacking system with redistribution and method of manufacture thereof

Seongmin Lee; Sungmin Song; Jong-Woo Ha

Archive | 2008

Integrated circuit package system with stacking module

Jong-Woo Ha; Flynn Carson; BumJoon Hong; Seongmin Lee

Archive | 2006

Integrated circuit package system employing bump technology

Jong-Woo Ha; BumJoon Hong

Archive | 2007

Integrated circuit package-in-package system with side-by-side and offset stacking

Soo-San Park; BumJoon Hong; Sang-Ho Lee; Jong-Woo Ha

Archive | 2009

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF

Choong Bin Yim; Hyeog Chan Kwon; Jong-Woo Ha

Archive | 2007

Integrated circuit package system with symmetric packaging

Soo-San Park; BumJoon Hong; Sang-Ho Lee; Jong-Woo Ha

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Collaboration

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BumJoon Hong

STATS ChipPAC Ltd

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Daesik Choi

STATS ChipPAC Ltd

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Sang-Ho Lee

STATS ChipPAC Ltd

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Soo-San Park

STATS ChipPAC Ltd

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Byoung Wook Jang

STATS ChipPAC Ltd

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Hyeog Chan Kwon

STATS ChipPAC Ltd

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Seongmin Lee

STATS ChipPAC Ltd

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Choong Bin Yim

STATS ChipPAC Ltd

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Seung Won Kim

STATS ChipPAC Ltd

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DeokKyung Yang

STATS ChipPAC Ltd

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